• DocumentCode
    1652898
  • Title

    Hot carrier reliability in GaAs PHEMT MMIC power amplifiers

  • Author

    Chou, Y.C. ; Grundbacher, R. ; Lai, R. ; Li, G.P. ; Kan, Q. ; Yu, M. ; Callejo, L. ; Leung, D. ; Eng, D. ; Block, T. ; Oki, A.

  • Author_Institution
    Northrop Grumman Space Technol., Redondo Beach, CA, USA
  • fYear
    2005
  • Firstpage
    590
  • Lastpage
    591
  • Keywords
    HEMT integrated circuits; MMIC power amplifiers; electric current; gallium arsenide; hot carriers; impact ionisation; integrated circuit reliability; life testing; power HEMT; semiconductor device reliability; 0.15 micron; GaAs; HEMT MMIC power amplifiers; drain current; gallium arsenide; gate current; hot carrier reliability; hot carrier stress testing; impact ionization; long-term lifetest; output power; output power degradation; transconductance; Degradation; Gallium arsenide; Hot carriers; Impact ionization; MMICs; PHEMTs; Power amplifiers; Power generation; Space technology; Stress;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium, 2005. Proceedings. 43rd Annual. 2005 IEEE International
  • Print_ISBN
    0-7803-8803-8
  • Type

    conf

  • DOI
    10.1109/RELPHY.2005.1493157
  • Filename
    1493157