• DocumentCode
    1652993
  • Title

    SPICE model development for SiC power MOSFET

  • Author

    Pratap, Rudra ; Singh, R.K. ; Agarwal, Vivek

  • Author_Institution
    Dept. of Electr. Eng., Motilal Nehru Nat. Inst. of Technol., Allahabad, India
  • fYear
    2012
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    SiC Power MOSFETs show a tremendous potential for high voltage, high temperature, high-power and high-frequency power electronic applications. A simplified SPICE model is proposed for the SiC Power MOSFET, CMF20120D, based on the understanding of the power MOSFET discrete devices terminal behavior. The aim of the model development is to reuse the available built-in MOSFET models of the regular lateral MOS devices in the commercial SPICE simulators and propose a new model to depict the same behavior as expected by SiC device. The advantage of such model is the limited number of required parameters, which can readily be extracted from simple external terminal measurements or from standard datasheets. The results of simulation and comparison with real device measurement show appreciable closeness with the datasheet.
  • Keywords
    SPICE; power MOSFET; power electronics; silicon compounds; CMF20120D; SPICE model development; SiC; external terminal measurements; high temperature applications; high-frequency power electronic applications; high-power applications; power MOSFET discrete devices terminal behavior; real device measurement; regular lateral MOS devices; standard datasheets; Integrated circuit modeling; MOSFET; Mathematical model; SPICE; Semiconductor device modeling; Silicon carbide; Temperature; MOSFET; SPICE model; SiC;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Power Electronics, Drives and Energy Systems (PEDES), 2012 IEEE International Conference on
  • Conference_Location
    Bengaluru
  • Print_ISBN
    978-1-4673-4506-4
  • Type

    conf

  • DOI
    10.1109/PEDES.2012.6484369
  • Filename
    6484369