Title :
Novel electrical re-connection of very thin fine pitch ball grid array (VFBGA) package for advanced backside fault isolation
Author :
Qian, Li ; Xu, Yan ; Song, Guobin ; Ji, Xiaoyu
Author_Institution :
Q&R, Intel Products (Shanghai) Ltd, Shanghai, China
Keywords :
ball grid arrays; failure analysis; integrated circuit interconnections; advanced product failure analysis; backside fault isolation; bond pads; electrical re-connection; front-side package dimensions; metal blocks; operating parameters; very thin fine pitch BGA; very thin fine pitch ball grid array; Bonding; Circuit faults; Electronics industry; Electronics packaging; Integrated circuit interconnections; Semiconductor device packaging; Silicon; Surface emitting lasers; Testing; Wires;
Conference_Titel :
Reliability Physics Symposium, 2005. Proceedings. 43rd Annual. 2005 IEEE International
Print_ISBN :
0-7803-8803-8
DOI :
10.1109/RELPHY.2005.1493169
