Title :
RF MEMS reference oscillator platform with ±0.5ppm frequency stability for wireless handsets
Author :
Kourani, Ali ; Hegazi, Emad ; Ismail, Yehea
Author_Institution :
Center for Nano-Electron. & Devices, American Univ. in Cairo & Zewail City for Sci. & Technol., Cairo, Egypt
Abstract :
This paper reports on the design of a complete RF MEMS reference oscillator platform to replace bulky quartz in wireless handsets targeting LTE specifications. 106 fs jitter, 76.8 MHz AlN-on-Si reference oscillator is designed with SiO2 layers for passive temperature compensation achieving frequency stability of 105 ppm across temperature ranges of -40°C to 85°C. The oscillator consumes 850 μA, with figure-of-merit FOM of 216 dB. Initial frequency offset of ±8000 ppm and temperature drift errors are combined and further addressed electronically. A novel simple digital compensation circuitry is presented in the paper. The circuit generates a compensation word as an input to 21 bit MASH 1-1-1 sigma delta modulator incorporated in RF LTE fractional N-PLL for frequency compensation. Temperature is sensed using low power band-gap front end circuitry with 12 bits temperature to digital converter TDC characterized by a resolution of 0.075°C, consuming only 4.6 μA. The achieved output frequency stability is ±0.5 ppm over temperature ranges from -40°C to 85°C for the most stringent 700 MHz LTE band.
Keywords :
III-V semiconductors; Long Term Evolution; aluminium compounds; compensation; frequency stability; jitter; micromechanical devices; mobile handsets; phase locked loops; radiofrequency oscillators; sigma-delta modulation; silicon; silicon compounds; wide band gap semiconductors; AlN; FOM; LTE specification; Long Term Evolution; MASH 1-1-1 sigma delta modulator; RF LTE fractional N-PLL; RF MEMS reference oscillator platform; Si; SiO2; aluminium nitride-on-silicon reference oscillator; bulky quartz; current 4.6 muA; current 850 muA; digital compensation circuitry; digital converter TDC; figure-of-merit; frequency 700 MHz; frequency 76.8 MHz; frequency compensation; frequency offset; frequency stability; jitter; low power band-gap front end circuitry; passive temperature compensation; phase locked loop; radiofrequency microelectromechanical system; temperature -40 C to 85 C; temperature 0.075 C; temperature drift error; temperature-digital converter; wireless handset; word length 12 bit; Circuit stability; Frequency modulation; Micromechanical devices; Oscillators; Resonant frequency; Temperature sensors; Thermal stability; LTE; MEMS; oscillator; sigma delta; temperature compensation; temperature to digital converter; wireless;
Conference_Titel :
Signals, Circuits and Systems (ISSCS), 2015 International Symposium on
Conference_Location :
Iasi
Print_ISBN :
978-1-4673-7487-3
DOI :
10.1109/ISSCS.2015.7203982