DocumentCode
1653672
Title
Comprehensive study of postprocessed copper heat sinks on smart power drivers for thermal SOA improvement
Author
Van den Bosch, G. ; Driessens, E. ; Webers, T. ; Elattari, B. ; Wojciechowski, D. ; Gassot, P. ; Moens, P. ; Groeseneken, Guido
Author_Institution
IMEC, Leuven, Belgium
fYear
2005
Firstpage
652
Lastpage
653
Keywords
copper; field effect transistor switches; heat sinks; power MOSFET; power integrated circuits; semiconductor device models; thermal management (packaging); thermal stability; 1 ms; 2D/3D thermal simulations; Cu; device energy capability; driver area reduction; heat dissipation; integrated power MOSFET switches; postprocessed heat sinks; safe operating area; smart power drivers; switching process electrothermal instability phenomena; thermal SOA improvement; Ambient intelligence; Copper; Heat sinks; Passivation; Power semiconductor switches; Semiconductor optical amplifiers; Service oriented architecture; Silicon; Temperature; Thermal management;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium, 2005. Proceedings. 43rd Annual. 2005 IEEE International
Print_ISBN
0-7803-8803-8
Type
conf
DOI
10.1109/RELPHY.2005.1493188
Filename
1493188
Link To Document