1653672

Comprehensive study of postprocessed copper heat sinks on smart power drivers for thermal SOA improvement

Van den Bosch, G. ; Driessens, E. ; Webers, T. ; Elattari, B. ; Wojciechowski, D. ; Gassot, P. ; Moens, P. ; Groeseneken, Guido

IMEC, Leuven, Belgium

2005

652

653

copper; field effect transistor switches; heat sinks; power MOSFET; power integrated circuits; semiconductor device models; thermal management (packaging); thermal stability; 1 ms; 2D/3D thermal simulations; Cu; device energy capability; driver area reduction; heat dissipation; integrated power MOSFET switches; postprocessed heat sinks; safe operating area; smart power drivers; switching process electrothermal instability phenomena; thermal SOA improvement; Ambient intelligence; Copper; Heat sinks; Passivation; Power semiconductor switches; Semiconductor optical amplifiers; Service oriented architecture; Silicon; Temperature; Thermal management;

English

ieee

Reliability Physics Symposium, 2005. Proceedings. 43rd Annual. 2005 IEEE International

0-7803-8803-8

conf

10.1109/RELPHY.2005.1493188

1493188