DocumentCode :
1653721
Title :
ZnO thin film transistors and circuits on glass and polyimide by low-temperature PEALD
Author :
Mourey, Devin A. ; Zhao, Dalong A. ; Jackson, Thomas N.
Author_Institution :
Dept. of Mater. Sci. & Eng., Penn State Univ., University Park, PA, USA
fYear :
2009
Firstpage :
1
Lastpage :
4
Abstract :
We report using a novel, weak oxidant, plasma-enhanced atomic layer deposition (PEALD) process to fabricate stable, high mobility ZnO thin film transistors (TFTs) and fast circuits on glass and polyimide substrates at 200 °C. Weak oxidant PEALD provides a simple, fast deposition process that results in uniform, conformal coatings and enhancement-mode MOSFETs from uncompensated films. Our PEALD ZnO TFTs have field-effect mobility of 20-30 cm2/V·s and simple gate-self-aligned saturated-load ring oscillators on glass with 2.5 ¿m gate length had propagation delay <10 ns/stage at VDD = 18 V. We also report the fastest oxide semiconductor circuits on polyimide substrates with propagation delay of ~60 ns/stage at VDD = 18 V.
Keywords :
II-VI semiconductors; MOSFET circuits; atomic layer deposition; conformal coatings; glass; polymers; semiconductor growth; substrates; thin film transistors; wide band gap semiconductors; zinc compounds; SiO2; ZnO; enhancement-mode MOSFET; field-effect mobility; gate length; gate-self-aligned saturated-load ring oscillators; glass substrates; high mobility ZnO thin film transistor; low-temperature PEALD; oxide semiconductor circuits; plasma-enhanced atomic layer deposition; polyimide substrates; propagation delay; size 2.5 mum; temperature 200 degC; uncompensated films; voltage 18 V; weak oxidant PEALD; Atomic layer deposition; Circuits; Coatings; Glass; Plasma stability; Polyimides; Propagation delay; Substrates; Thin film transistors; Zinc oxide;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting (IEDM), 2009 IEEE International
Conference_Location :
Baltimore, MD
Print_ISBN :
978-1-4244-5639-0
Electronic_ISBN :
978-1-4244-5640-6
Type :
conf
DOI :
10.1109/IEDM.2009.5424388
Filename :
5424388
Link To Document :
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