• DocumentCode
    1653856
  • Title

    Disulfide Bond Prediction using Neural Network and Secondary Structure Information

  • Author

    Shi, Ouyan ; Yang, Huiyun ; Cai, Chunquan ; Yang, Jing ; Tian, Xin

  • Author_Institution
    Fac. of Basic Med., Tianjin Med. Univ., Tianjin
  • fYear
    2008
  • Firstpage
    656
  • Lastpage
    659
  • Abstract
    In protein-folding prediction, the location of disulfide bonds can strongly reduce the search in the conformational space. Therefore the correct prediction of the disulfide connectivity starting from the protein residue sequence may also help in predicting its 3D structure. In this paper, we describe a method to predict disulfide connectivity in a protein given only the amino acid sequence, using neural network, and given input of symmetric flanking regions of N-terminus and C-terminus cystines augmented with residue secondary structure (helix, sheet, and coil) as well as evolutionary information. 252 protein sequences were selected from the SWISS-PROT database. From the results of 4-fold cross validation, we find that merging protein secondary structure allows us to obtain significant prediction accuracy improvements.
  • Keywords
    biochemistry; biology computing; learning (artificial intelligence); molecular biophysics; neural nets; proteins; C-terminus cystines; N-terminus cystines; SWISS-PROT database; amino acid sequence; conformational space; disulfide bond prediction; disulfide bonds location; disulfide connectivity; evolutionary information; neural network; novel machine learning method; protein residue sequence; protein secondary structure information; protein-folding prediction; residue secondary structure; Amino acids; Biomedical engineering; Bonding; Coils; Databases; Hidden Markov models; Hospitals; Neural networks; Neurosurgery; Protein sequence;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Bioinformatics and Biomedical Engineering, 2008. ICBBE 2008. The 2nd International Conference on
  • Conference_Location
    Shanghai
  • Print_ISBN
    978-1-4244-1747-6
  • Electronic_ISBN
    978-1-4244-1748-3
  • Type

    conf

  • DOI
    10.1109/ICBBE.2008.160
  • Filename
    4535040