DocumentCode :
1654032
Title :
Observation of switching behaviors in post-breakdown conduction in NiSi-gated stacks
Author :
Liu, W.H. ; Pey, K.L. ; Li, X. ; Bosman, M.
Author_Institution :
Sch. of EEE, Nanyang Technol. Univ., Singapore, Singapore
fYear :
2009
Firstpage :
1
Lastpage :
4
Abstract :
For NiSi FUSI gate transistors, switching behaviors have been observed after breakdown (BD) under certain favorable conditions. The conductive BD path can be ¿switched-off¿ if a reverse bias, as opposed to the stressing voltage, is applied, a condition required for observing SET and RESET conduction in switching material systems. Using the percolation model of BD of gate dielectric systems, we explain this switching behavior as a result of passivation of oxygen-deficient BD path. First ionized oxygen atoms are removed from the BD path upon BD, and are driven by e-field and ¿stored¿ in the NiSi gate. Then, upon applying a threshold reverse bias, they are driven back to the nanoscale BD path and due to the presence of a Joule heating in the highly resistive BD path, they rebond/passivate the Si dangling bonds in the oxygen-deficient BD path. This means that BD transistor can be ¿repaired¿ electrically by a reverse threshold voltage to expend its lifetime.
Keywords :
MOSFET; dangling bonds; hafnium compounds; nickel alloys; passivation; percolation; semiconductor device breakdown; semiconductor device models; silicon alloys; silicon compounds; FUSI gate transistors; NiSi-HfSiON-SiOx; NiSi-SiON; RESET conduction; SET conduction; dangling bonds; gate dielectric systems; ionized oxygen atoms; oxygen-deficient breakdown path; passivation; percolation model; post-breakdown conduction; rebonding; reverse threshold voltage; stressing voltage; switching behaviors; switching material systems; threshold reverse bias; Conducting materials; Dielectric materials; Electric breakdown; Electrodes; MOSFET circuits; Microelectronics; Passivation; Performance evaluation; Tin; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting (IEDM), 2009 IEEE International
Conference_Location :
Baltimore, MD
Print_ISBN :
978-1-4244-5639-0
Electronic_ISBN :
978-1-4244-5640-6
Type :
conf
DOI :
10.1109/IEDM.2009.5424402
Filename :
5424402
Link To Document :
بازگشت