DocumentCode
1654080
Title
Fast WLRC applications in foundry fabrication
Author
Tseng, Summer ; Chien, W. T Kary ; Wang, Willing ; Zhao, Atman ; Gong, Excimer
Author_Institution
Reliability Eng. Div., Semicond. Manufactory Int. Corp., Shanghai, China
fYear
2005
Firstpage
676
Lastpage
677
Keywords
contact resistance; electromigration; integrated circuit manufacture; integrated circuit reliability; integrated circuit testing; semiconductor device reliability; advanced microelectronic fabrication; double-point gate oxide integrity test; fast I-ramp electromigration test; foundry fabrication; probe contact resistance; reliability test methods; reliability test structures; test accuracy; test effectiveness; test pattern; test stability; wafer level reliability control test; Contact resistance; Control charts; Fabrication; Foundries; Leakage current; Probes; Reliability engineering; Stability; Testing; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium, 2005. Proceedings. 43rd Annual. 2005 IEEE International
Print_ISBN
0-7803-8803-8
Type
conf
DOI
10.1109/RELPHY.2005.1493200
Filename
1493200
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