1654111

Novel test strategy for statistical evaluation of defect density and reliability of contacts and VIAS

Cabrini, A. ; Cantarelli, D. ; Cappelletti, P. ; Casiraghi, R. ; Iezzi, D. ; Lombardi, C. ; Maurelli, A. ; Pasotti, M. ; Roland, P.L. ; Torelli, G.

Dipt. di Elettronica, Pavia Univ., Italy

2005

678

679

failure analysis; integrated circuit interconnections; integrated circuit reliability; integrated circuit testing; integrated circuit yield; statistical testing; defect density evaluation; failure analysis; interconnect contacts; interconnect reliability; interconnect vias; process yield; resistive contacts/vias; statistical IC test strategy; Condition monitoring; Decoding; Electrical resistance measurement; Failure analysis; Read only memory; Research and development; Semiconductor device measurement; Statistical analysis; Statistical distributions; Testing;

English

ieee

Reliability Physics Symposium, 2005. Proceedings. 43rd Annual. 2005 IEEE International

0-7803-8803-8

conf

10.1109/RELPHY.2005.1493201

1493201