DocumentCode
1654111
Title
Novel test strategy for statistical evaluation of defect density and reliability of contacts and VIAS
Author
Cabrini, A. ; Cantarelli, D. ; Cappelletti, P. ; Casiraghi, R. ; Iezzi, D. ; Lombardi, C. ; Maurelli, A. ; Pasotti, M. ; Roland, P.L. ; Torelli, G.
Author_Institution
Dipt. di Elettronica, Pavia Univ., Italy
fYear
2005
Firstpage
678
Lastpage
679
Keywords
failure analysis; integrated circuit interconnections; integrated circuit reliability; integrated circuit testing; integrated circuit yield; statistical testing; defect density evaluation; failure analysis; interconnect contacts; interconnect reliability; interconnect vias; process yield; resistive contacts/vias; statistical IC test strategy; Condition monitoring; Decoding; Electrical resistance measurement; Failure analysis; Read only memory; Research and development; Semiconductor device measurement; Statistical analysis; Statistical distributions; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium, 2005. Proceedings. 43rd Annual. 2005 IEEE International
Print_ISBN
0-7803-8803-8
Type
conf
DOI
10.1109/RELPHY.2005.1493201
Filename
1493201
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