Title :
Design, comparison and analysis of a novel 3-D decoupling micromanipulator with different numbers of S-joints
Author :
Zhigang Wu ; Yangmin Li
Author_Institution :
Dept. of Electromech. Eng., Univ. of Macau, Macau, China
Abstract :
In this paper, the XYZ translational parallel micromanipulator with three-dimension is proposed. The whole mechanism is fully symmetric about x and y axes. The end-effector with the centre of the plane may acquire the ideal effect according to using the different number of S-hinges (spherical hinge with three degrees of freedom). Therefore, the four types of mechanisms with different numbers of S-hinges are analyzed and designed. The output displacements in the x and y directions are found that there are not much impact, but the influence in the z direction is different for four kinds of S-hinges. A comparison is made for the kinematics performances and decoupling characteristics of the different micromanipulators, and then the best one can be selected as the mechanism. The workspaces for the micromanipulator can be produced at last. According to results of the analysis with the ANSYS software, the errors for the x, y and z directions are lower than 2%, and the displacement loss is about 15% in the x and y directions, so the kinematic performances of the novel stage are validated.
Keywords :
design engineering; end effectors; finite element analysis; hinges; manipulator kinematics; micromanipulators; 3D decoupling micromanipulator analysis; 3D decoupling micromanipulator comparison; 3D decoupling micromanipulator design; ANSYS software; S-hinge analysis; S-hinge design; XYZ translational parallel micromanipulator; decoupling characteristics; displacement loss; end-effector; kinematics performances; plane centre; s-joints; spherical hinge; three-degree-of-freedom; three-dimension; x axes; x-directions; y axes; y-directions; z-directions; Computer architecture; Finite element analysis; Joints; Kinematics; Materials; Micromanipulators; Software;
Conference_Titel :
Nanotechnology (IEEE-NANO), 2014 IEEE 14th International Conference on
Conference_Location :
Toronto, ON
DOI :
10.1109/NANO.2014.6967956