Title :
A practical substrate modeling algorithm with active guardband macromodel for mixed-signal substrate coupling verification
Author :
Chan, Henry H Y ; Zilic, Zeljko
Author_Institution :
McGill Univ., Montreal, Que., Canada
fDate :
6/23/1905 12:00:00 AM
Abstract :
Substrate-coupled switching noise is a major concern for mixed-signal circuit design. In this paper, an efficient substrate extraction algorithm based on Delaunay triangulation is proposed for heavily-doped bulk substrate. Macromodel of active noise suppression guard band that enhances noise insulation efficiency is also incorporated. SPICE simulation results of circuit layouts comprising the proposed substrate model are compared against those generated by Cadence Substrate Coupling Analysis tool
Keywords :
SPICE; circuit layout CAD; circuit simulation; integrated circuit layout; integrated circuit noise; mesh generation; mixed analogue-digital integrated circuits; Cadence substrate coupling analysis tool; Delaunay triangulation; SPICE simulation; active noise suppression; circuit layouts; guard band; heavily-doped bulk substrate; mixed-signal circuit design; noise insulation efficiency; substrate extraction algorithm; substrate-coupled switching noise; Active noise reduction; Analytical models; Circuit noise; Circuit simulation; Costs; Coupling circuits; Interference; Protection; SPICE; Switching circuits;
Conference_Titel :
Electronics, Circuits and Systems, 2001. ICECS 2001. The 8th IEEE International Conference on
Print_ISBN :
0-7803-7057-0
DOI :
10.1109/ICECS.2001.957489
