Title :
A low-voltage bulk-silicon tunneling-based microaccelerometer
Author :
Yeh, Chingwen ; Najafi, Khalil
Author_Institution :
Center for Integrated Sensors & Circuits, Michigan Univ., Ann Arbor, MI, USA
Abstract :
This paper describes the design, fabrication, and testing of a low-driving-voltage (⩽10 V) bulk-silicon tunneling-based microaccelerometer. Using the bulk-silicon fabrication technology and boron etch-stop dissolved wafer process, one of the devices with an active area of 400×400 μm2 has been successfully fabricated, fully characterized, and electrostatically tested. The d.c. sensitivity is 1.66×104 ppm/g (133 mV/g) and the gain bandwidth is 2 kHz in air. The device provides a full scale range of -20 g to 10 g with a nonlinearity of 0.6%. The measured sensitivity variation is ±150 ppm per g (≈0.9%) over three weeks, which is primarily attributed to the change of tip characteristics and creep of microstructures over time. The temperature coefficient of offset (TCO) and temperature coefficient of sensitivity (TCS) are -600 ppm/°C and 1200 ppm/°C respectively
Keywords :
accelerometers; elemental semiconductors; microsensors; sensitivity; silicon; tunnelling; 10 V; DC sensitivity; Si; active area; electrostatic test; etch-stop dissolved wafer process; fabrication technology; gain bandwidth; nonlinearity; sensitivity variation; temperature coefficient of offset; temperature coefficient of sensitivity; tip characteristics; tunneling-based microaccelerometer; Bandwidth; Boron; Creep; Electrostatic measurements; Etching; Fabrication; Microstructure; Temperature sensors; Testing; Time measurement;
Conference_Titel :
Electron Devices Meeting, 1995. IEDM '95., International
Conference_Location :
Washington, DC
Print_ISBN :
0-7803-2700-4
DOI :
10.1109/IEDM.1995.499291