DocumentCode :
1656535
Title :
A monolithic thermal inkjet printhead utilizing electrochemical etching and two-step electroplating techniques
Author :
Lee, Jae-Duk ; Lee, Hi-Deok ; Lee, Ho-Jun ; Yoon, Jun-Bo ; Han, Ki-Ho ; Kim, Jae-Kwan ; Kim, Choong-ki ; Han, Chul-Hi
Author_Institution :
Dept. of Electr. Eng., Korea Adv. Inst. of Sci. & Technol., Taejon, South Korea
fYear :
1995
Firstpage :
601
Lastpage :
604
Abstract :
An integrated fabrication method for a monolithic thermal inkjet printhead is proposed. It utilizes silicon micromachining techniques, such as electrochemical etching to form the main ink feedthrough and two-step nickel electroplating to form the ink cavities and nozzles. The main ink feedthrough is formed by etching the substrate from the back side and the etched hole is automatically aligned with the pattern defined on the front side. The cavity and nozzles are formed sequentially on the silicon substrate by a two-step electroplating. The monolithic batch process provides accurate control in the dimensions of the nozzle and the main ink feedthrough. The fabricated inkjet printhead shows the droplet size of 100 μm in diameter and stable ejection of ink droplets of more than 180 million
Keywords :
electroplating; elemental semiconductors; etching; ink jet printers; micromachining; micromechanical devices; silicon; thermal printers; 100 micron; Si; droplet size; electrochemical etching; etched hole; ink cavities; ink feedthrough; micromachining techniques; monolithic batch process; nozzle dimensions; stable ejection; thermal inkjet printhead; two-step electroplating techniques; Colored noise; Costs; Etching; Heating; Helium; Ink; Printing; Resistors; Silicon; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting, 1995. IEDM '95., International
Conference_Location :
Washington, DC
ISSN :
0163-1918
Print_ISBN :
0-7803-2700-4
Type :
conf
DOI :
10.1109/IEDM.1995.499293
Filename :
499293
Link To Document :
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