Two-dimensional array transducers using hybrid connection technology

Author

Smith, Stephen W. ; Light, Edward D.

Author_Institution

Dept. of Biomed, Eng., Duke Univ., Durham, NC, USA

fYear

1992

Firstpage

555

Abstract

A new electrical connection technique for 2-D array transducers is reported. It consists of 16×16=256 PZT 5H elements operating at 2.5 MHz fabricated by hand wiring. The connection technique employs a multilayer ceramic (MLC) connector (thick-film hybrid microelectronic technology) consisting of 20 thick films of alumina and screen printed metallization with customized interconnections between the layers called vias. Ten ground layers are interleaved between ten signal layers to reduce electrical cross-talk. A λ/4 mismatching layer of conductive epoxy is bonded between each PZT element and the silver metal pad of the MLC connector to provide a low impedance backing. Vector impedance, sensitivity, and bandwidth are all in good agreement between conventional fabrication and the MLC connector. Interelement cross-talk is improved by 10 dB

Keywords

acoustic arrays; ceramics; lead compounds; piezoelectric transducers; thick film devices; ultrasonic transducers; 2-D array transducers; 2.5 MHz; Al₂O₃; PZT elements; PbZrO3TiO3; US transducer; bandwidth; conductive epoxy; customized interconnections; electrical connection technique; hybrid connection technology; low impedance backing; mismatching layer; multilayer ceramic; piezoelectric transducer; screen printed metallization; sensitivity; vector impedance; vias; Bonding; Ceramics; Connectors; Impedance; Metallization; Microelectronics; Nonhomogeneous media; Thick films; Transducers; Wiring;

fLanguage

English

Publisher

ieee

Conference_Titel

Ultrasonics Symposium, 1992. Proceedings., IEEE 1992

Conference_Location

Tucson, AZ

Print_ISBN

0-7803-0562-0

Type

conf

DOI

10.1109/ULTSYM.1992.275946

Filename

275946