• DocumentCode
    1657336
  • Title

    Monolithic planar RF inductor and waveguide structures on silicon with performance comparable to those in GaAs MMIC

  • Author

    Kim, Bon-Kee ; Ko, Beom-Kyu ; Lee, Kwyro ; Jeong, Ji-Won ; Lee, Kun-Sang ; Kim, Seong-Chan

  • Author_Institution
    Dept. of Electr. Eng., Korea Adv. Inst. of Sci. & Technol., Taejon, South Korea
  • fYear
    1995
  • Firstpage
    717
  • Lastpage
    720
  • Abstract
    The monolithic inductors and transmission lines on Si substrate with very high Q factor, low insertion loss, and high resonant frequency, are achieved by using very thick polyimide (10 μm) as dielectric material, and thick Al (4 μm) metalization system. This structure is made on the finished conventional standard two layer metalization BiCMOS wafer. For 10 nH inductor, 6 GHz resonant frequency, maximum Q factor of 5.5 at 1.2 GHz, and 1.2 dB insertion loss at 3 GHz are obtained, which are very comparable to those available in GaAs MMIC, These inductors can be used as RF choke as well as matching element. Transmission lines are also fabricated using this technology. The S21 of coplanar waveguide with 1 mm length is -0.2 dB at 4 GHz, and that of microstrip line is -0.3 dB. It is expected that, using these passive elements, Si RF IC can be designed up to several GHz with performance comparable to GaAs MMIC
  • Keywords
    MMIC; Q-factor; coplanar waveguides; elemental semiconductors; inductors; integrated circuit metallisation; losses; microstrip lines; polymer films; silicon; 1 to 6 GHz; 1.2 dB; BiCMOS wafer; Q factor; RF choke; Si; coplanar waveguide; insertion loss; matching element; metalization system; microstrip line; monolithic RF IC; planar RF inductor; polyimide; resonant frequency; waveguide structures; Gallium arsenide; Inductors; Insertion loss; MMICs; Planar transmission lines; Planar waveguides; Q factor; Radio frequency; Resonant frequency; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 1995. IEDM '95., International
  • Conference_Location
    Washington, DC
  • ISSN
    0163-1918
  • Print_ISBN
    0-7803-2700-4
  • Type

    conf

  • DOI
    10.1109/IEDM.1995.499319
  • Filename
    499319