Modal response of bonding wires under thermal loading

This paper reports on the influence of thermal loading on the mechanical behavior of bonding wires. First, an experimental technique is developed to measure the quasi-static displacement of bonding wire. It is then deployed to measure the displacement, as well as peak temperature, of three different types of bonding wires to identify their loading conditions under DC current. An experimental technique is also developed and deployed to study of the modal response of bonding wires under thermal loads. Experimental results show a drop in the natural frequency of bonding wires with increased thermal loads. The experimental procedures developed here and applied to thick bonding wires offer a template for quasi-static and modal analysis of thin bonding wires under thermal loads at the micro- and nano-scales.