DocumentCode
1657962
Title
Interface effects on thermal conductivity of Bi/Te core-shell nanowires
Author
Kang, Joohoon ; Ham, Jinhee ; Roh, Jong Wook ; Lee, Seunghyun ; Lee, Wooyoung
Author_Institution
Dept. of Mater. Sci. & Eng., Yonsei Univ., Seoul, South Korea
fYear
2010
Firstpage
115
Lastpage
116
Abstract
The formation of variable 1D heterostructure including core-shell and tubular nanowire is of particular significance with respect to potential applications for the thermoelectric device with the enhanced figure of merit (ZT=S2¿T/¿). We report Bi-Te core/shell and Te tubular nanowire fabrication based on the stress induced method. Fig. 1 schematically shows the nanowire fabrication process. Bi nanowires are grown on the Si substrate by the stress-induced method, and then Te is evaporated on the Bi nanowires. Fig. 2 is TEM image clearly shows core/shell structure for which effective phonon scattering and quantum confinement effect are expected. Our results demonstrate that various 1D heterostructure like Bi-Te core/shell and Te tubular nanowire can be grown successfully by the stress-induced method. Based on the result of electrical transport measurement and its characteristic morphology of rough surface, we will measure Seebeck coefficient and thermal conductivity in the future work.
Keywords
Seebeck effect; bismuth; electrical conductivity; evaporation; internal stresses; nanofabrication; nanowires; phonons; surface morphology; surface roughness; tellurium; thermal conductivity; transmission electron microscopy; 1D heterostructure; Bi-Te; Seebeck coefficient; TEM image; Te; core-shell nanowires; electrical transport measurement; evaporation; interface effects; nanowire fabrication process; phonon scattering; quantum confinement effect; rough surface morphology; stress-induced method; thermal conductivity; thermoelectric device applications; tubular nanowire; Bismuth; Conductivity measurement; Electric variables measurement; Fabrication; Nanowires; Structural shells; Tellurium; Thermal conductivity; Thermal stresses; Thermoelectric devices;
fLanguage
English
Publisher
ieee
Conference_Titel
Nanoelectronics Conference (INEC), 2010 3rd International
Conference_Location
Hong Kong
Print_ISBN
978-1-4244-3543-2
Electronic_ISBN
978-1-4244-3544-9
Type
conf
DOI
10.1109/INEC.2010.5424564
Filename
5424564
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