• DocumentCode
    1657997
  • Title

    Scaleable shadow stack for a configurable DSP concept

  • Author

    Panis, Christian ; Leitner, Raimund ; Nurmi, Jari

  • Author_Institution
    Carinthian Tech Inst., Villach, Austria
  • fYear
    2003
  • Firstpage
    222
  • Lastpage
    227
  • Abstract
    SoC (System-on-Chip) applications map complex system functions on a single die. The increasing importance of flexibility in SoC applications leads to raising portion implemented in firmware. Therefore, the demand on computational power of the embedded processors in the application is increasing. The newest silicon technologies (e.g. 0.13 μm and lower) help to increase the reachable frequency, but the demand cannot be sufficiently satisfied. One approach to increase the processor frequency is the introduction of pipelining. To guarantee data consistency in deep pipelined processors different methods have been developed. Additional complexity is introduced by the occurrence of interrupts. This paper describes a concept to enable data consistency between the instructions of different pipeline stages in pipelined DSP kernels during interrupt service routines, without the interaction of the DSP itself and with no restrictions concerning the nesting level of the interrupts. The scaleable shadow stack is part of a development project for a configurable DSP concept.
  • Keywords
    digital signal processing chips; interrupts; pipeline processing; system-on-chip; 0.13 micron; SoC application; configurable DSP; data consistency; digital signal processing; embedded processor; interrupt service routine; pipeline stage; pipelined DSP kernel; pipelined processor; pipelining; processor frequency; scaleable shadow stack; system-on-chip; Application software; CMOS technology; Digital signal processing; Frequency; Kernel; Microprogramming; Pipeline processing; Registers; Switches; System-on-a-chip;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    System-on-Chip for Real-Time Applications, 2003. Proceedings. The 3rd IEEE International Workshop on
  • Print_ISBN
    0-7695-1944-X
  • Type

    conf

  • DOI
    10.1109/IWSOC.2003.1213039
  • Filename
    1213039