DocumentCode
1658044
Title
Fabrication of integrated copper indium diselenide nanorod arrays on silicon using porous anodic alumina as template
Author
Zhang, Zhongwei ; Liu, Weifeng ; Li, Ji ; Han, Yunxin ; Jiang, Guoshun ; Surya, Charles ; Zhu, Changfei
Author_Institution
Dept. of Mater. Sci. & Eng., Univ. of Sci. & Technol. of China, Hefei, China
fYear
2010
Firstpage
118
Lastpage
119
Abstract
Vertically aligned copper indium diselenide nanorod arrays were synthesized by electrodeposition using porous anodic alumina template supported on a tungsten/silicon substrate. Porous anodic alumina template was fabricated by anodizing aluminium film which was sputtered onto tungsten/silicon substrate. The approach employed a selective chemical etching to penetrate the barrier layer at the bottom of alumina pore before electrodeposition. It enables direct electrical and chemical contact with the underside substrate electrode. The as-deposited sample was annealed at 450°C in vacuum. High resolution transmission electron microscopy and X-ray diffraction showed high purity CuInSe2 nanorods with a preferred [112] orientation. Scanning electron microscopy revealed that the nanorods were dense and compact with diameter about 100 nm and with length approximate 1000 nm. Energy-dispersive X-ray spectroscopy showed fabrication of nearly close to stoichiometric CuInSe2. The energy band gap of this nonorod arrays was analysed by fundamental absorption spectrum and evaluated to be 1.06 eV.
Keywords
X-ray chemical analysis; X-ray diffraction; alumina; annealing; anodisation; copper compounds; electrodeposition; electrodes; energy gap; etching; indium compounds; nanofabrication; nanorods; porous materials; scanning electron microscopy; silicon; sputtered coatings; stoichiometry; ternary semiconductors; texture; transmission electron microscopy; tungsten; Al2O3; CuInSe2; W-Si; X-ray diffraction; absorption spectrum; annealing; anodizing aluminium film; barrier layer; chemical contact; direct electrical contact; electrical property; electrodeposition; energy band gap; energy-dispersive X-ray spectroscopy; high resolution transmission electron microscopy; integrated copper indium diselenide nanorod arrays; porous anodic alumina; preferred [112] orientation; scanning electron microscopy; selective chemical etching; sputtering; stoichiometry; temperature 450 degC; tungsten-silicon substrate; Aluminum; Chemicals; Copper; Electrons; Fabrication; Indium; Semiconductor films; Silicon; Substrates; Tungsten;
fLanguage
English
Publisher
ieee
Conference_Titel
Nanoelectronics Conference (INEC), 2010 3rd International
Conference_Location
Hong Kong
Print_ISBN
978-1-4244-3543-2
Electronic_ISBN
978-1-4244-3544-9
Type
conf
DOI
10.1109/INEC.2010.5424567
Filename
5424567
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