• DocumentCode
    1658044
  • Title

    Fabrication of integrated copper indium diselenide nanorod arrays on silicon using porous anodic alumina as template

  • Author

    Zhang, Zhongwei ; Liu, Weifeng ; Li, Ji ; Han, Yunxin ; Jiang, Guoshun ; Surya, Charles ; Zhu, Changfei

  • Author_Institution
    Dept. of Mater. Sci. & Eng., Univ. of Sci. & Technol. of China, Hefei, China
  • fYear
    2010
  • Firstpage
    118
  • Lastpage
    119
  • Abstract
    Vertically aligned copper indium diselenide nanorod arrays were synthesized by electrodeposition using porous anodic alumina template supported on a tungsten/silicon substrate. Porous anodic alumina template was fabricated by anodizing aluminium film which was sputtered onto tungsten/silicon substrate. The approach employed a selective chemical etching to penetrate the barrier layer at the bottom of alumina pore before electrodeposition. It enables direct electrical and chemical contact with the underside substrate electrode. The as-deposited sample was annealed at 450°C in vacuum. High resolution transmission electron microscopy and X-ray diffraction showed high purity CuInSe2 nanorods with a preferred [112] orientation. Scanning electron microscopy revealed that the nanorods were dense and compact with diameter about 100 nm and with length approximate 1000 nm. Energy-dispersive X-ray spectroscopy showed fabrication of nearly close to stoichiometric CuInSe2. The energy band gap of this nonorod arrays was analysed by fundamental absorption spectrum and evaluated to be 1.06 eV.
  • Keywords
    X-ray chemical analysis; X-ray diffraction; alumina; annealing; anodisation; copper compounds; electrodeposition; electrodes; energy gap; etching; indium compounds; nanofabrication; nanorods; porous materials; scanning electron microscopy; silicon; sputtered coatings; stoichiometry; ternary semiconductors; texture; transmission electron microscopy; tungsten; Al2O3; CuInSe2; W-Si; X-ray diffraction; absorption spectrum; annealing; anodizing aluminium film; barrier layer; chemical contact; direct electrical contact; electrical property; electrodeposition; energy band gap; energy-dispersive X-ray spectroscopy; high resolution transmission electron microscopy; integrated copper indium diselenide nanorod arrays; porous anodic alumina; preferred [112] orientation; scanning electron microscopy; selective chemical etching; sputtering; stoichiometry; temperature 450 degC; tungsten-silicon substrate; Aluminum; Chemicals; Copper; Electrons; Fabrication; Indium; Semiconductor films; Silicon; Substrates; Tungsten;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nanoelectronics Conference (INEC), 2010 3rd International
  • Conference_Location
    Hong Kong
  • Print_ISBN
    978-1-4244-3543-2
  • Electronic_ISBN
    978-1-4244-3544-9
  • Type

    conf

  • DOI
    10.1109/INEC.2010.5424567
  • Filename
    5424567