DocumentCode
1658079
Title
Highly-reliable gate oxide formation for giga-scale LSIs by using closed wet cleaning system and wet oxidation with ultra-dry unloading
Author
Yugami, Jiro ; Itoga, Toshihiko ; Ohkura, Makoto
Author_Institution
Central Res. Lab., Hitachi Ltd., Kokubunji, Japan
fYear
1995
Firstpage
855
Lastpage
858
Abstract
We controlled the Si surface just before the oxidation process and the moisture during oxide formation to improve gate oxide quality. This was done with a closed wet cleaning (CWC) system and load-lock oxidation system. We found that wet oxidation with ultra-dry unloading (WODU) combined with pre-cleaning in a CWC system resulted in a highly-reliable gate oxide. The predicted reliability of the gate oxide formed using these techniques improved significantly, showing that a 90% yield is expected after ten years of operation, even when the total gate area is more than 1 cm2 and the electric field is as high as 5 MV/cm, which is sufficient for giga-scale ULSIs
Keywords
MOS integrated circuits; ULSI; failure analysis; integrated circuit reliability; integrated circuit yield; oxidation; surface cleaning; MOS integrated circuits; Si; ULSI; closed wet cleaning system; electric field; gate oxide formation; giga-scale LSIs; load-lock oxidation system; pre-cleaning; reliability; total gate area; ultra-dry unloading; wet oxidation; yield; Cleaning; Control systems; Electric breakdown; Hafnium; Large scale integration; MOS capacitors; Moisture control; Oxidation; Ultra large scale integration; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 1995. IEDM '95., International
Conference_Location
Washington, DC
ISSN
0163-1918
Print_ISBN
0-7803-2700-4
Type
conf
DOI
10.1109/IEDM.1995.499351
Filename
499351
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