DocumentCode :
1658079
Title :
Highly-reliable gate oxide formation for giga-scale LSIs by using closed wet cleaning system and wet oxidation with ultra-dry unloading
Author :
Yugami, Jiro ; Itoga, Toshihiko ; Ohkura, Makoto
Author_Institution :
Central Res. Lab., Hitachi Ltd., Kokubunji, Japan
fYear :
1995
Firstpage :
855
Lastpage :
858
Abstract :
We controlled the Si surface just before the oxidation process and the moisture during oxide formation to improve gate oxide quality. This was done with a closed wet cleaning (CWC) system and load-lock oxidation system. We found that wet oxidation with ultra-dry unloading (WODU) combined with pre-cleaning in a CWC system resulted in a highly-reliable gate oxide. The predicted reliability of the gate oxide formed using these techniques improved significantly, showing that a 90% yield is expected after ten years of operation, even when the total gate area is more than 1 cm2 and the electric field is as high as 5 MV/cm, which is sufficient for giga-scale ULSIs
Keywords :
MOS integrated circuits; ULSI; failure analysis; integrated circuit reliability; integrated circuit yield; oxidation; surface cleaning; MOS integrated circuits; Si; ULSI; closed wet cleaning system; electric field; gate oxide formation; giga-scale LSIs; load-lock oxidation system; pre-cleaning; reliability; total gate area; ultra-dry unloading; wet oxidation; yield; Cleaning; Control systems; Electric breakdown; Hafnium; Large scale integration; MOS capacitors; Moisture control; Oxidation; Ultra large scale integration; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting, 1995. IEDM '95., International
Conference_Location :
Washington, DC
ISSN :
0163-1918
Print_ISBN :
0-7803-2700-4
Type :
conf
DOI :
10.1109/IEDM.1995.499351
Filename :
499351
Link To Document :
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