• DocumentCode
    1658079
  • Title

    Highly-reliable gate oxide formation for giga-scale LSIs by using closed wet cleaning system and wet oxidation with ultra-dry unloading

  • Author

    Yugami, Jiro ; Itoga, Toshihiko ; Ohkura, Makoto

  • Author_Institution
    Central Res. Lab., Hitachi Ltd., Kokubunji, Japan
  • fYear
    1995
  • Firstpage
    855
  • Lastpage
    858
  • Abstract
    We controlled the Si surface just before the oxidation process and the moisture during oxide formation to improve gate oxide quality. This was done with a closed wet cleaning (CWC) system and load-lock oxidation system. We found that wet oxidation with ultra-dry unloading (WODU) combined with pre-cleaning in a CWC system resulted in a highly-reliable gate oxide. The predicted reliability of the gate oxide formed using these techniques improved significantly, showing that a 90% yield is expected after ten years of operation, even when the total gate area is more than 1 cm2 and the electric field is as high as 5 MV/cm, which is sufficient for giga-scale ULSIs
  • Keywords
    MOS integrated circuits; ULSI; failure analysis; integrated circuit reliability; integrated circuit yield; oxidation; surface cleaning; MOS integrated circuits; Si; ULSI; closed wet cleaning system; electric field; gate oxide formation; giga-scale LSIs; load-lock oxidation system; pre-cleaning; reliability; total gate area; ultra-dry unloading; wet oxidation; yield; Cleaning; Control systems; Electric breakdown; Hafnium; Large scale integration; MOS capacitors; Moisture control; Oxidation; Ultra large scale integration; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 1995. IEDM '95., International
  • Conference_Location
    Washington, DC
  • ISSN
    0163-1918
  • Print_ISBN
    0-7803-2700-4
  • Type

    conf

  • DOI
    10.1109/IEDM.1995.499351
  • Filename
    499351