• DocumentCode
    1658369
  • Title

    The glue in a confident SoC flow

  • Author

    Ferguson, John

  • Author_Institution
    Mentor Graphics Corp., Wilsonville, OR, USA
  • fYear
    2003
  • Firstpage
    316
  • Lastpage
    319
  • Abstract
    System-on-chip (SoC) design combines individual components created by various design groups, and developed using numerous design styles, methodologies and knowledge levels. Despite the functionality strength realized by this engineering diversity, each component must meet a common standard during development-the physical verification requirements of the foundry or manufacturer. As designs become larger and more complex, and design rules become more numerous, greater demand is placed on EDA toolmakers to develop tools and methodologies that will not only help streamline the design process with efficiency and accuracy, but will also accommodate various design styles while establishing a common standard across the industry. Adopting a single physical verification and extraction flow will not only streamline the SoC design process, thereby saving time and resources, but also act as the glue that binds the many components into a cohesive system. Choosing EDA tools that not only meet the rigorous internal verification standards set by the foundry, but also are widely adopted throughout the industry, ensures confident design and data transfer among SoC providers.
  • Keywords
    electronic design automation; formal verification; integrated circuit design; system-on-chip; EDA toolmakers; SoC design process; confident data transfer; design-to-silicon; extraction flow; manufacturing requirements; physical verification; single tool flow; system-on-chip design; verification standards; Databases; Design methodology; Electronic design automation and methodology; Foundries; Gold; Graphics; Knowledge engineering; Manufacturing industries; Process design; Standards development;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    System-on-Chip for Real-Time Applications, 2003. Proceedings. The 3rd IEEE International Workshop on
  • Print_ISBN
    0-7695-1944-X
  • Type

    conf

  • DOI
    10.1109/IWSOC.2003.1213055
  • Filename
    1213055