• DocumentCode
    1658771
  • Title

    Fabrication of Si/SiO2/Au nanoparticles/HfO2 MOS capacitor structure by spin coating method

  • Author

    Chen, Shih-Tang ; Chen, Hua-Chiang ; Huang, Kun-Cheng ; Liu, Fu-Ken ; Leu, Ching-Chich

  • Author_Institution
    Dept. of Chem. & Mater. Eng., Nat. Univ. of Kaohsiung, Kaohsiung, Taiwan
  • fYear
    2010
  • Firstpage
    710
  • Lastpage
    711
  • Abstract
    In this work, a Metal-Oxide-Semiconductor (MOS) capacitor (Si/SiO2/Au nanoparticles/HfO2) has been fabricated. Gold (Au) nanoparticles with particle size of about 3.3 nm were synthesized by chemical reduction method. Then the self-assembled gold nanoparticles were attached to 3-aminopropyltrimethoxysilane (APTMS) modified silicon oxide substrates by the spin coating method. With the spin coating method, the gold nanoparticles can be fabricated onto 5.0 nm thermally grown silicon oxide with highly packing density of 1 × 1012 cm-2 in a short processing time. Finally, the sol-gel derived HfO2 layer was spin coated to construct a Si/SiO2/Au nanoparticles/HfO2 structure. The MOS structure embedded with Au nanoparticles showed well defined counterclockwise C-V hysteresis curves which indicating a good memory effect. The flat-band voltage shift was about 2.7 V at a swapping voltage between ±5 V. Furthermore, the MOS structure embedded with Au nanoparticles behaved a desirable retention characteristic up to 104s. We have succeeded to fabricate the Metal-Oxide-Semiconductor capacitor structure (Si/SiO2/Au nanoparticles/HfO2) by a spin coating method. The spin coating method has many advantages like short fabrication time, high uniformity, and better reproducibility when compared with the traditional immersion method. Therefore, the spin coating method has the potential to be applied to nanofabrication processes in mass production.
  • Keywords
    MOS capacitors; elemental semiconductors; gold; nanoelectronics; nanoparticles; organic compounds; particle size; reduction (chemical); self-assembly; silicon; silicon compounds; sol-gel processing; spin coating; 3-aminopropyltrimethoxysilane; APTMS modified silicon oxide substrate; C-V hysteresis curves; MOS capacitor structure; Si-SiO2-Au-HfO2; chemical reduction method; flat-band voltage shift; mass production; memory effect; metal-oxide-semiconductor capacitor; packing density; particle size; self-assembled gold nanoparticles; sol-gel technique; spin coating method; traditional immersion method; Chemicals; Coatings; Fabrication; Gold; Hafnium oxide; MOS capacitors; Nanoparticles; Self-assembly; Silicon; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nanoelectronics Conference (INEC), 2010 3rd International
  • Conference_Location
    Hong Kong
  • Print_ISBN
    978-1-4244-3543-2
  • Electronic_ISBN
    978-1-4244-3544-9
  • Type

    conf

  • DOI
    10.1109/INEC.2010.5424590
  • Filename
    5424590