• DocumentCode
    1659025
  • Title

    Life-cycle Assessment of LSI Packaging Embossed Tape Made from Bio-based Polymer

  • Author

    Horikoshi, Y. ; Hashitani, T. ; Kutami, M. ; Yazaki, K. ; Ando, Y.

  • Author_Institution
    Fujitsu Labs. Ltd.
  • fYear
    2005
  • Firstpage
    122
  • Lastpage
    123
  • Abstract
    This paper assesses the life-cycle of packaging materials designed to protect large-scale integration devices from shock and static electricity when they are transported from semiconductor factories to printed-circuit-board factories. Carbon dioxide (CO2) emitted during production and incineration was reduced by 11% when embossed plastic tape packaging made from non-renewable sources was replaced by material made from bio-based polymer
  • Keywords
    incineration; plastic packaging; polymers; semiconductor device packaging; LSI packaging; bio-based polymer; carbon dioxide emissions; embossed plastic tape; incineration; integration devices; life-cycle assessment; nonrenewable sources; packaging materials; printed-circuit-board factories; semiconductor factories; shock; static electricity; Biological materials; Carbon dioxide; Electric shock; Incineration; Large scale integration; Polymers; Production facilities; Protection; Semiconductor device packaging; Semiconductor materials;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Environmentally Conscious Design and Inverse Manufacturing, 2005. Eco Design 2005. Fourth International Symposium on
  • Conference_Location
    Tokyo
  • Print_ISBN
    1-4244-0081-3
  • Type

    conf

  • DOI
    10.1109/ECODIM.2005.1619183
  • Filename
    1619183
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1659025