DocumentCode :
1659264
Title :
A computational study on interfacial doping and quantum transport of silicide-silicon contacts
Author :
Ouyang, Yijian ; Chauhan, Jyotsna ; Guo, Jing
Author_Institution :
Dept. of Electr. & Comput. Eng., Univ. of Florida, Gainesville, FL, USA
fYear :
2010
Firstpage :
169
Lastpage :
170
Abstract :
In nanoscale silicon CMOS, the contact resistance could considerable lower the on-current and significantly increase the delay. Most models of metal-semiconductor and silicide-silicon contacts remain over-simplified and phenomenological. In this study, ab initio simulations based on the density-functional theory (DFT) and quantum transport simulations based on the non-equilibrium Green´s function (NEGF) formalism have been developed to model and investigate the technologically important silicide-silicon contacts. The results indicate that in spite of the existence of a considerable metal-induced bandgap states, a carefully designed interfacial doping scheme can effectively modulate the Schottky barrier height (SBH). The modulation of the SBH can transform a rectifying I-V characteristic of a Schottky diode to a nearly linear I-V characteristic of an ohmic contact even without changing the bulk semiconductor doping density.
Keywords :
CMOS integrated circuits; Green´s function methods; Schottky barriers; Schottky diodes; ab initio calculations; contact resistance; density functional theory; ohmic contacts; semiconductor doping; I-V characteristic; Schottky barrier height; Schottky diode; Si; ab initio simulations; bulk semiconductor doping density; contact resistance; density functional theory; interfacial doping; metal-induced bandgap states; metal-semiconductor contacts; nanoscale silicon CMOS; nonequilibrium Green´s function; ohmic contact; quantum transport simulations; silicide-silicon contacts; Computational modeling; Computer interfaces; Contact resistance; Delay; Quantum computing; Quantum mechanics; Semiconductor device doping; Semiconductor device modeling; Semiconductor process modeling; Silicon;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Nanoelectronics Conference (INEC), 2010 3rd International
Conference_Location :
Hong Kong
Print_ISBN :
978-1-4244-3543-2
Electronic_ISBN :
978-1-4244-3544-9
Type :
conf
DOI :
10.1109/INEC.2010.5424606
Filename :
5424606
Link To Document :
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