DocumentCode
1659670
Title
TDNVRAMTM: methodology and architecture of a nonvolatile-memory technology development testchip
Author
Montanari, D. ; Deshazo, D. ; Yeric, G.
Author_Institution
TestChip Technol. Inc, Plano, TX, USA
Volume
2
fYear
2001
fDate
6/23/1905 12:00:00 AM
Firstpage
933
Abstract
In today´s flash technology development, most of the critical issues arise at the ´array level´, not at the ´device level´. Problems such as read disturb, program/erase endurance and erratic bits are critical for the release of a given technology into production and its yield. However, these problems are generally tackled relatively late in the development cycle. This paper proposes a novel methodology and testchip architecture aimed to address the issues mentioned above very early in the technology development cycle
Keywords
flash memories; integrated circuit testing; integrated memory circuits; memory architecture; TDNVRAM; development test chip; flash technology development; nonvolatile-memory technology; technology development cycle; testchip architecture; Cellular phones; Computer errors; DVD; Energy consumption; Humans; Low voltage; Personal digital assistants; Production; Research and development; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics, Circuits and Systems, 2001. ICECS 2001. The 8th IEEE International Conference on
Print_ISBN
0-7803-7057-0
Type
conf
DOI
10.1109/ICECS.2001.957626
Filename
957626
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