• DocumentCode
    1659697
  • Title

    Effect of TiO2 nanoparticles on dielectric properties of CuO ceramics

  • Author

    Maensiri, Santi ; Thongbai, Prasit ; Yamwong, Teerapon

  • Author_Institution
    Dept. of Phys., Khon Kaen Univ., Khon Kaen, Thailand
  • fYear
    2010
  • Firstpage
    688
  • Lastpage
    689
  • Abstract
    We reported the dielectric properties of CuO-xTiO2 (CT) (x=0, 0.02, 0.01, and 0.20) ceramics prepared by a conventional mixed oxide method. X-ray diffraction and scanning electron microscopy were used to characterize the phase formation and microstructure of the CT ceramics, respectively. The microstructure analysis showed that the nanoparticles of TiO2 were accumulated in the microstructure both of grain boundaries and the outmost surface layer of the ceramics. The dielectric constant of the CT ceramics decreased with increasing the concentration of the TiO2 content. Our result also revealed that the concentration of TiO2 had a remarkable influence on the dielectric relaxation of the CT ceramics. The giant dielectric properties of theses CT ceramics might be ascribed based on the interfacial polarization at the grain boundary and the surface layers.
  • Keywords
    X-ray diffraction; ceramics; copper compounds; dielectric polarisation; dielectric relaxation; grain boundaries; nanoparticles; permittivity; scanning electron microscopy; titanium compounds; CuO-TiO2; X-ray diffraction; ceramics; conventional mixed oxide method; dielectric constant; dielectric relaxation; grain boundary; interfacial polarization; microstructure; nanoparticles; phase formation; scanning electron microscopy; surface layer; Ceramics; Dielectric constant; Frequency; Grain boundaries; Microstructure; Nanoparticles; Polarization; Scanning electron microscopy; Surface morphology; X-ray diffraction;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nanoelectronics Conference (INEC), 2010 3rd International
  • Conference_Location
    Hong Kong
  • Print_ISBN
    978-1-4244-3543-2
  • Electronic_ISBN
    978-1-4244-3544-9
  • Type

    conf

  • DOI
    10.1109/INEC.2010.5424623
  • Filename
    5424623