DocumentCode :
1659697
Title :
Effect of TiO2 nanoparticles on dielectric properties of CuO ceramics
Author :
Maensiri, Santi ; Thongbai, Prasit ; Yamwong, Teerapon
Author_Institution :
Dept. of Phys., Khon Kaen Univ., Khon Kaen, Thailand
fYear :
2010
Firstpage :
688
Lastpage :
689
Abstract :
We reported the dielectric properties of CuO-xTiO2 (CT) (x=0, 0.02, 0.01, and 0.20) ceramics prepared by a conventional mixed oxide method. X-ray diffraction and scanning electron microscopy were used to characterize the phase formation and microstructure of the CT ceramics, respectively. The microstructure analysis showed that the nanoparticles of TiO2 were accumulated in the microstructure both of grain boundaries and the outmost surface layer of the ceramics. The dielectric constant of the CT ceramics decreased with increasing the concentration of the TiO2 content. Our result also revealed that the concentration of TiO2 had a remarkable influence on the dielectric relaxation of the CT ceramics. The giant dielectric properties of theses CT ceramics might be ascribed based on the interfacial polarization at the grain boundary and the surface layers.
Keywords :
X-ray diffraction; ceramics; copper compounds; dielectric polarisation; dielectric relaxation; grain boundaries; nanoparticles; permittivity; scanning electron microscopy; titanium compounds; CuO-TiO2; X-ray diffraction; ceramics; conventional mixed oxide method; dielectric constant; dielectric relaxation; grain boundary; interfacial polarization; microstructure; nanoparticles; phase formation; scanning electron microscopy; surface layer; Ceramics; Dielectric constant; Frequency; Grain boundaries; Microstructure; Nanoparticles; Polarization; Scanning electron microscopy; Surface morphology; X-ray diffraction;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Nanoelectronics Conference (INEC), 2010 3rd International
Conference_Location :
Hong Kong
Print_ISBN :
978-1-4244-3543-2
Electronic_ISBN :
978-1-4244-3544-9
Type :
conf
DOI :
10.1109/INEC.2010.5424623
Filename :
5424623
Link To Document :
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