Title :
Low-cost surface mount packaging for SAWs
Author :
Gore, J. ; Horine, Bryce ; Phillips, J. ; Hoffman, R. ; Dodge, J.
Author_Institution :
Sawtek Inc., Orlando, FL, USA
Abstract :
The special challenges of surface mount technology as they apply to the surface acoustic wave (SAW) manufacturer are reviewed. Some possible solutions are offered. The effects of each of the problem areas on the choice of package technology are considered. The technology options include ceramic bases (solder, epoxy, resistance welded, or glass frit sealed), plastic (epoxy sealed), and quartz (glass frit sealed). Emphasis is placed on ceramic bases as they seem to best fulfill the requirements of the commercial marketplace at this time. The tradeoffs of each sealing technique are discussed. The issue of thermal mismatch is addressed for leadless packages, with some suggestions on how to manage it. Some ideas on test fixturing are given
Keywords :
ceramics; soldering; surface acoustic wave devices; surface acoustic wave filters; surface mount technology; SAW; SAW filters; SAWs; SMT; ceramic bases; epoxy sealing; glass frit sealing; leadless packages; low cost; package technology; plastic; quartz; resistance welding; solder sealing; surface acoustic wave; surface mount packaging; surface mount technology; test fixturing; thermal mismatch; tradeoffs; Acoustic waves; Ceramics; Glass; Manufacturing; Packaging; Sawing machines; Surface acoustic waves; Surface resistance; Surface-mount technology; Thermal management;
Conference_Titel :
Ultrasonics Symposium, 1992. Proceedings., IEEE 1992
Conference_Location :
Tucson, AZ
Print_ISBN :
0-7803-0562-0
DOI :
10.1109/ULTSYM.1992.276052
