Title :
Wetting behaviour of lead free solder on electroplated Ni and Ni-W alloy barrier film
Author :
Chew, C.S. ; Haseeb, A.S.M.A. ; Johan, M.R.
Author_Institution :
Dept. of Mech. Eng., Univ. of Malaya, Kuala Lumpur, Malaysia
Abstract :
In this work, electrodeposited of Ni-W alloys were studied as barrier films between Cu substrate and lead free Sn3.8Ag0.7Cu (SAC387) solder. Wetting angle and spreading rate of SAC387 on Ni-W alloys with different tungsten contents were investigated and compared with that on Ni film deposited from Watt´s bath. Ni-W alloy films of about 1.5 to 2.5 ¿m were deposited from ammonia-citrate bath on copper substrate. Results show solder/Ni-W alloy system and solder/Ni system exhibited almost the same spreading rate and wetting angle.
Keywords :
copper alloys; electrodeposits; metallic thin films; nickel; nickel alloys; silver alloys; solders; tin alloys; tungsten alloys; wetting; Sn3.8Ag0.7Cu-Ni; Sn3.8Ag0.7Cu-NiW; Watt bath; electroplated barrier film; lead free solder; spreading rate; wetting angle; Copper alloys; Electronics industry; Environmentally friendly manufacturing techniques; Intermetallic; Lead; Nickel alloys; Optical films; Soldering; Substrates; Tungsten;
Conference_Titel :
Nanoelectronics Conference (INEC), 2010 3rd International
Conference_Location :
Hong Kong
Print_ISBN :
978-1-4244-3543-2
Electronic_ISBN :
978-1-4244-3544-9
DOI :
10.1109/INEC.2010.5424676
