• DocumentCode
    1661461
  • Title

    Application of SEMATECH Defect Model to a 0.6 μm process defect reduction

  • Author

    Saha, Sujit ; Mittal, Sanjiv ; McDonald, Chris

  • Author_Institution
    Intel Corp., Santa Clara, CA, USA
  • fYear
    1994
  • Firstpage
    273
  • Abstract
    Summary form only given. This paper will describe the application of the SEMATECH Defect Model for setting equipment level goals for a new 8" process technology at the inception of the process development. The paper will also show how the model validation was made using a similar process and sort yield visual data, how those goals were used to drive equipment team level improvements and resulting die yield impacts. We will also show how the model results can be used to prioritize competing improvement projects for the highest overall output
  • Keywords
    semiconductor process modelling; 0.6 micron; 8 in; SEMATECH defect model; defect reduction; die yield; equipment level; process development; process technology; semiconductor industry; sort visual data; Conference management; Costs; Educational institutions; Electronics industry; Predictive models; Production facilities; Semiconductor device manufacture; Strategic planning; Virtual manufacturing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Semiconductor Manufacturing Conference and Workshop. 1994 IEEE/SEMI
  • Conference_Location
    Cambridge, MA
  • Print_ISBN
    0-7803-2053-0
  • Type

    conf

  • DOI
    10.1109/ASMC.1994.588271
  • Filename
    588271