DocumentCode :
1661490
Title :
A 1.2V 38nm 2.4Gb/s/pin 2Gb DDR4 SDRAM with bank group and ×4 half-page architecture
Author :
Koo, Kibong ; Ok, Sunghwa ; Kang, Yonggu ; Kim, Seungbong ; Song, Choungki ; Lee, Hyeyoung ; Kim, Hyungsoo ; Yongmi Kim ; Jeonghun Lee ; Oak, Seunghan ; Lee, Yosep ; Jungyu Lee ; Lee, Jeonghun ; Lee, Hyungyu ; Jang, Jaemin ; Jung, Jongho ; Choi, Byeongcha
Author_Institution :
Hynix Semicond., Icheon, South Korea
fYear :
2012
Firstpage :
40
Lastpage :
41
Abstract :
DDR4 SDRAM is expected to realize low power consumption and high bandwidth using a 1.2V nominal supply voltage and to be a cost-effective solution for various applications. In this paper, bank group architecture, internal reference voltage level (IVREF) and pre-emphasis to overcome conventional operating frequency range are presented. CS_n to command/address latency (CAL), data bus inversion (DBI) and ×4 half-page architecture are introduced to reduce current consumption. Cyclic redundancy check (CRC) and command and address (CA) parity are adopted to check transmission errors in high bandwidth. Also, read CRC with DBI is calculated in parallel to mitigate calculation time and area penalty. Consequently, our 2Gb DDR4 SDRAM achieves 2.4Gb/s data rate at 1.0V supply voltage.
Keywords :
DRAM chips; cyclic redundancy check codes; field buses; low-power electronics; reference circuits; ×4 half-page architecture; CA parity; CAL; CRC; DBI; DDR4 SDRAM; IVREF; area penalty; bank group architecture; calculation time; command and address parity; command-address latency; conventional operating frequency range; cost-effective solution; current consumption reduction; cyclic redundancy check; data bus inversion; internal reference voltage level; low power consumption; memory size 2 GByte; nominal supply voltage; size 38 nm; transmission errors; voltage 1.2 V; Current measurement; Delta modulation; Parity check codes; SDRAM; Semiconductor device measurement; Timing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Circuits Conference Digest of Technical Papers (ISSCC), 2012 IEEE International
Conference_Location :
San Francisco, CA
ISSN :
0193-6530
Print_ISBN :
978-1-4673-0376-7
Type :
conf
DOI :
10.1109/ISSCC.2012.6176869
Filename :
6176869
Link To Document :
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