Considerations on Printed Wiring Board design for Fatigue Reliability of Pb-free soldered leadless packages

Author

Kikuchi, Shunichi ; Higashi, Osamu ; Yamada, Mitsutaka ; Ozaki, Noritsugu

Author_Institution

Fujitsu Ltd., Kawasaki

fYear

2005

Firstpage

567

Lastpage

568

Abstract

As a task in IMS-EFSOT (Intelligent Manufacturing Systems - next generation Environment Friendly Soldering Technology) program, considerable items in PWB (Printed Wiring Board) design for Pb-free products is studied. The findings about the relationship between PWB layout and the peak temperatures of mounted parts in reflow soldering as deliverables from the study of 2001-2003 is summarized. In this paper, findings about the relationship between PWB design and the fatigue reliability of Pb-free soldered leadless packages is given. Several parameters on the PWB and found key factors for dominating the lifetime of solder joint reliability is varied

Keywords

design for environment; electronics packaging; environmental factors; fatigue; manufacturing systems; printed circuit design; printed circuit manufacture; reflow soldering; reliability; wiring; IMS-EFSOT program; Pb-free soldered leadless packages; environment friendly soldering technology; fatigue reliability; intelligent manufacturing systems; mounted parts; peak temperatures; printed wiring board design; reflow soldering; Ceramics; Fatigue; Gold; Lead; Packaging; Soldering; Temperature; Testing; Tin; Wiring;

fLanguage

English

Publisher

ieee

Conference_Titel

Environmentally Conscious Design and Inverse Manufacturing, 2005. Eco Design 2005. Fourth International Symposium on

Conference_Location

Tokyo

Print_ISBN

1-4244-0081-3

Type

conf

DOI

10.1109/ECODIM.2005.1619296

Filename

1619296