• DocumentCode
    1662143
  • Title

    Thermal-aware clustered microarchitectures

  • Author

    Chaparro, Pedro ; González, José ; González, Antonio

  • Author_Institution
    Intel Barcelona Res. Center, Univ. Politecnica de Catalunya, Barcelona, Spain
  • fYear
    2004
  • Firstpage
    48
  • Lastpage
    53
  • Abstract
    As frequencies and feature size scale faster than operating voltages, power density is increasing in each processor generation. Power density and the cost of removing the heat it generates are increasing at the same rate. Leakage is significantly increasing every process generation and it is expected to be the main source of power in the near future. Moreover, leakage power grows exponentially with temperature. This paper proposes and evaluates several techniques with two goals: reduction of average temperature in order to decrease leakage power, and reduction of peak temperature in order to reduce cooling cost. Combinations of temperature-aware steering techniques and cluster hopping are investigated in a quad-cluster superscalar microarchitecture. Combining cluster hopping with a temperature-aware steering policy results in 30% reduction in leakage power and 8% reduction in average peak temperature at the expense of a slowdown of just 5%.
  • Keywords
    computer architecture; cost reduction; microprocessor chips; thermal management (packaging); cluster hopping technique; cooling cost reduction; leakage power reduction; quad cluster superscalar microarchitecture; temperature aware steering policy; temperature aware steering technique; temperature reduction; thermal aware clustered microarchitectures; Computer architecture; Cooling; Costs; Frequency; Microarchitecture; Power dissipation; Power generation; Temperature; Voltage; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer Design: VLSI in Computers and Processors, 2004. ICCD 2004. Proceedings. IEEE International Conference on
  • ISSN
    1063-6404
  • Print_ISBN
    0-7695-2231-9
  • Type

    conf

  • DOI
    10.1109/ICCD.2004.1347897
  • Filename
    1347897