Title :
Defect density reduction in tungsten deposition and etchback
Author :
Anderson, Bob ; Berezin, Alan ; Emami, Iraj
Author_Institution :
Adv. Micro Devices Inc., Austin, TX, USA
Abstract :
An in-line defect density monitor was developed to measure the defect contribution for tungsten deposition and etchback. By continuously monitoring the processes, a number of defect generating mechanisms were discovered in both deposition and etch systems. By targeting improvements in equipment, processes, and maintenance, a factor of ten improvement was realized on the integrated monitor. The improvements also resulted in improved product yield and eliminated low yield excursions
Keywords :
metallisation; W; etchback; in-line defect density monitor; product yield; tungsten deposition; Condition monitoring; Conductivity; Density measurement; Etching; Optical films; Optical scattering; Plugs; Pollution measurement; Tensile stress; Tungsten;
Conference_Titel :
Advanced Semiconductor Manufacturing Conference and Workshop. 1994 IEEE/SEMI
Conference_Location :
Cambridge, MA
Print_ISBN :
0-7803-2053-0
DOI :
10.1109/ASMC.1994.588275