• DocumentCode
    1662370
  • Title

    Defect density reduction in tungsten deposition and etchback

  • Author

    Anderson, Bob ; Berezin, Alan ; Emami, Iraj

  • Author_Institution
    Adv. Micro Devices Inc., Austin, TX, USA
  • fYear
    1994
  • Firstpage
    279
  • Lastpage
    281
  • Abstract
    An in-line defect density monitor was developed to measure the defect contribution for tungsten deposition and etchback. By continuously monitoring the processes, a number of defect generating mechanisms were discovered in both deposition and etch systems. By targeting improvements in equipment, processes, and maintenance, a factor of ten improvement was realized on the integrated monitor. The improvements also resulted in improved product yield and eliminated low yield excursions
  • Keywords
    metallisation; W; etchback; in-line defect density monitor; product yield; tungsten deposition; Condition monitoring; Conductivity; Density measurement; Etching; Optical films; Optical scattering; Plugs; Pollution measurement; Tensile stress; Tungsten;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Semiconductor Manufacturing Conference and Workshop. 1994 IEEE/SEMI
  • Conference_Location
    Cambridge, MA
  • Print_ISBN
    0-7803-2053-0
  • Type

    conf

  • DOI
    10.1109/ASMC.1994.588275
  • Filename
    588275