Lifetime Estimation for Wire Bond Interconnections using Life-Cycle-Information Modules with Implemented Models

Author

Middendorf, A. ; Reichl, H. ; Griese, H.

Author_Institution

Tech. Univ. Berlin

fYear

2005

Firstpage

614

Lastpage

619

Abstract

Information on product use conditions is essential for sound strategies of product service as well as takeback, refurbishing, reuse of components, or recycling. Furthermore such information could improve future product design, market research and quality management. This paper describes a modular concept for life-cycle monitoring, as well as the identification of use conditions, reliability assessment and diagnosis of insulated gate bipolar transistors (IGBT) with a focus on the wire bond interconnections

Keywords

condition monitoring; insulated gate bipolar transistors; product design; product life cycle management; recycling; reliability; remaining life assessment; condition monitoring; insulated gate bipolar transistors; life-cycle-information modules; lifetime estimation; market research; product design; product service; quality management; recycling; reliability assessment; reuse; wire bond interconnections; Bonding; Condition monitoring; Insulated gate bipolar transistors; Life estimation; Lifetime estimation; Market research; Product design; Quality management; Recycling; Wire; Aging Models; IGBT Reliability; Life Cycle Unit (LCU); Remaining Lifetime Estimation; Reuse;

fLanguage

English

Publisher

ieee

Conference_Titel

Environmentally Conscious Design and Inverse Manufacturing, 2005. Eco Design 2005. Fourth International Symposium on

Conference_Location

Tokyo

Print_ISBN

1-4244-0081-3

Type

conf

DOI

10.1109/ECODIM.2005.1619309

Filename

1619309