Title :
Strategy to optimize the development, use, and dimension of test structures to control defect appearance in backend process steps
Author :
Hess, Christopher
Author_Institution :
Inst. of Comput. Design & Fault Tolerance, Karlsruhe Univ., Germany
Abstract :
To inspect and classify defects occurring during backend process steps, this paper describes a comprehensive methodology how to develop, use, and dimension test structures and how to optimize their organization inside given test chip boundaries. Starting point is the description of process steps and known types of defects. According to existing design rules different test structures will be designed and arranged as (in-line) process monitors inside a checkerboard framework using standard boundary pads
Keywords :
integrated circuit testing; backend process steps; boundary pads; checkerboard framework; defect classification; defect inspection; design; in-line monitoring; optimization; test structures; Circuit faults; Circuit testing; Conducting materials; Electric variables measurement; Manufacturing processes; Optimization methods; Process control; Semiconductor device measurement; Semiconductor device testing; Semiconductor materials;
Conference_Titel :
Advanced Semiconductor Manufacturing Conference and Workshop. 1994 IEEE/SEMI
Conference_Location :
Cambridge, MA
Print_ISBN :
0-7803-2053-0
DOI :
10.1109/ASMC.1994.588276