• DocumentCode
    1662682
  • Title

    An Integrated Manufacturing and Product Services System (IMPSS) Concept for Sustainable Product Development

  • Author

    Lee Hui Mien ; Lu Wen Feng ; Gay, R.

  • Author_Institution
    School of Electrical and Electronic Engineering, Nanyang Technological University, leeh0015@ntu.edu.sg
  • fYear
    2005
  • Firstpage
    656
  • Lastpage
    662
  • Abstract
    There is increasing pressure for manufacturers especially those in the electronics product industry to adopt sustainable product development due to the current problems of electronics waste (e-waste) and legislations such as the WEEE directives by EU. E-waste is accumulating at an exponential rate in poor developing areas in China and India because of higher rate of disposal of electronics goods. They are causing serious environmental problems as there are improper handlings of these e-wastes due to the lack of knowledge and recycling systems. In this paper, a framework integrating proper end-of-life management into the product development life cycle to close up the loop is proposed. A framework infrastructure system leveraging on the new information and web technologies such as semantic web services and ontology is then proposed to promote effective and efficient sharing of knowledge and information within the entire closed product life cycle.
  • Keywords
    E-waste; Sustainable product development; information system; product life cycle management; product service system; Electronic waste; Electronics industry; Environmental factors; Industrial electronics; Legislation; Manufacturing industries; Ontologies; Product development; Recycling; Semantic Web; E-waste; Sustainable product development; information system; product life cycle management; product service system;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Environmentally Conscious Design and Inverse Manufacturing, 2005. Eco Design 2005. Fourth International Symposium on
  • Print_ISBN
    1-4244-0081-3
  • Type

    conf

  • DOI
    10.1109/ECODIM.2005.1619319
  • Filename
    1619319