Parameterized thermal macromodeling for fast and effective design of electronic components and systems

Author

Ferranti, Francesco ; Dhaene, Tom ; Russo, S. ; Magnani, A. ; de Magistris, M. ; d´Alessandro, Vincenzo ; Rinaldi, Niccolo

Author_Institution

Dept. of Inf. Technol. (INTEC), iMinds, Ghent Univ., Ghent, Belgium

fYear

2014

fDate

11-14 May 2014

Firstpage

1

Lastpage

4

Abstract

We present a parameterized macromodeling approach to perform fast and effective dynamic thermal simulations of electronic components and systems where key design parameters vary. A decomposition of the frequency-domain data samples of the thermal impedance matrix is proposed to improve the accuracy of the model and reduce the number of the computationally costly thermal simulations needed to build the macromodel. The methodology is successfully applied to analyze the impact of layout variations on the dynamic thermal behavior of a state-of-the-art 8-finger AlGaN/GaN HEMT grown on a SiC substrate.

Keywords

III-V semiconductors; aluminium compounds; gallium compounds; high electron mobility transistors; semiconductor device models; silicon compounds; wide band gap semiconductors; 8-finger HEMT; AlGaN-GaN; SiC; computationally costly thermal simulations; design parameters; dynamic thermal behavior; dynamic thermal simulations; electronic components; electronic systems; frequency-domain data samples; layout variations; parameterized thermal macromodeling; thermal impedance matrix; Accuracy; Computational modeling; Data models; Estimation; HEMTs; Impedance; Layout;

fLanguage

English

Publisher

ieee

Conference_Titel

Signal and Power Integrity (SPI), 2014 IEEE 18th Workshop on

Conference_Location

Ghent

Type

conf

DOI

10.1109/SaPIW.2014.6844530

Filename

6844530