DocumentCode :
166269
Title :
Parameterized thermal macromodeling for fast and effective design of electronic components and systems
Author :
Ferranti, Francesco ; Dhaene, Tom ; Russo, S. ; Magnani, A. ; de Magistris, M. ; d´Alessandro, Vincenzo ; Rinaldi, Niccolo
Author_Institution :
Dept. of Inf. Technol. (INTEC), iMinds, Ghent Univ., Ghent, Belgium
fYear :
2014
fDate :
11-14 May 2014
Firstpage :
1
Lastpage :
4
Abstract :
We present a parameterized macromodeling approach to perform fast and effective dynamic thermal simulations of electronic components and systems where key design parameters vary. A decomposition of the frequency-domain data samples of the thermal impedance matrix is proposed to improve the accuracy of the model and reduce the number of the computationally costly thermal simulations needed to build the macromodel. The methodology is successfully applied to analyze the impact of layout variations on the dynamic thermal behavior of a state-of-the-art 8-finger AlGaN/GaN HEMT grown on a SiC substrate.
Keywords :
III-V semiconductors; aluminium compounds; gallium compounds; high electron mobility transistors; semiconductor device models; silicon compounds; wide band gap semiconductors; 8-finger HEMT; AlGaN-GaN; SiC; computationally costly thermal simulations; design parameters; dynamic thermal behavior; dynamic thermal simulations; electronic components; electronic systems; frequency-domain data samples; layout variations; parameterized thermal macromodeling; thermal impedance matrix; Accuracy; Computational modeling; Data models; Estimation; HEMTs; Impedance; Layout;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Signal and Power Integrity (SPI), 2014 IEEE 18th Workshop on
Conference_Location :
Ghent
Type :
conf
DOI :
10.1109/SaPIW.2014.6844530
Filename :
6844530
Link To Document :
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