• DocumentCode
    1662765
  • Title

    Network-on-chip: the intelligence is in the wire

  • Author

    Mas, Gerard ; Martin, Philippe

  • Author_Institution
    STMicroelectron., Crolles, France
  • fYear
    2004
  • Firstpage
    174
  • Lastpage
    177
  • Abstract
    In this paper, we describe how network-on-chip (NoC) can be the next major challenge to implement complex and function-rich applications in advanced manufacturing processes at 90 nm technology and below. Although much progress has been made in connecting the various components encompassed in communication networks for system-on-chip (SoC) designs (e.g., processor-specific bus architectures, interface adapters, etc.), until now there has not been the possibility to consider a chip-wide architectural methodology that takes into account all typical NoC design requirements. As design complexity continues to increase, a more global approach is required to effectively transport and manage both on-chip and off-chip communication traffic, optimize wire efficiency and permit designs to scale in size, complexity, and IP block usage. The system described in this work is based on an innovative switching fabric that allows designers to build an efficient and scalable architecture for NoC implementation, without disrupting the existing IP interconnect solutions currently used in the design tools and flows.
  • Keywords
    circuit complexity; integrated circuit design; integrated circuit interconnections; switching networks; system-on-chip; wires (electric); IP block usage; SoC design; circuit complexity; communication networks; integrated circuit interconnections; network-on-chip; system-on-chip design; wire efficiency; Communication networks; Communication switching; Design optimization; Intelligent networks; Joining processes; Manufacturing processes; Network-on-a-chip; Process design; System-on-a-chip; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer Design: VLSI in Computers and Processors, 2004. ICCD 2004. Proceedings. IEEE International Conference on
  • ISSN
    1063-6404
  • Print_ISBN
    0-7695-2231-9
  • Type

    conf

  • DOI
    10.1109/ICCD.2004.1347918
  • Filename
    1347918