DocumentCode :
1662875
Title :
Hole mobility in SiGe inversion layers: Dependence on surface orientation, channel direction, and strain
Author :
Hsieh, Bing-Fong ; Chang, Shu-Tong ; Lee, Ming-Hong
Author_Institution :
Dept. of Electr. Eng., Nat. Chung Hsing Univ., Taichung, Taiwan
fYear :
2010
Firstpage :
606
Lastpage :
607
Abstract :
Hole mobility in high Ge-content SiGe inversion layer is measured and simulated by a split C-V method and a quantized k.p method, respectively. For an arbitrary crystallographic surface orientation the two dimensional hole gas subband structure is calculated by solving the 6 × 6 k.p Schrodinger equation self-consistently with the electrostatic potential. Three important scattering mechanisms are included: optical phonon scattering, acoustic phonon scattering and surface roughness scattering. The model parameters are calibrated by matching the measured low-field mobility of SiGe on (001) Si wafers. The calibrated model reproduces our experimental channel mobility measurements for biaxial strain SiGe on (001), (111) and (110) substrates.
Keywords :
Ge-Si alloys; MOSFET; Schrodinger equation; crystal orientation; hole mobility; internal stresses; inversion layers; semiconductor materials; substrates; surface roughness; (001) substrate; (110) substrate; (111) substrate; 2D hole gas subband structure; Schrodinger equation; SiGe; SiGe inversion layers; acoustic phonon scattering; biaxial strain; channel direction; channel mobility measurements; crystallographic surface orientation; electrostatic potential; hole mobility; optical phonon scattering; pMOSFET; quantized k.p method; silicon wafers; split C-V method; substrates; surface roughness scattering; Acoustic scattering; Capacitive sensors; Electrostatic measurements; Germanium silicon alloys; Optical scattering; Phonons; Rough surfaces; Semiconductor device modeling; Silicon germanium; Surface roughness;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Nanoelectronics Conference (INEC), 2010 3rd International
Conference_Location :
Hong Kong
Print_ISBN :
978-1-4244-3543-2
Electronic_ISBN :
978-1-4244-3544-9
Type :
conf
DOI :
10.1109/INEC.2010.5424749
Filename :
5424749
Link To Document :
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