DocumentCode
166306
Title
3-D FDFD non-conformal domain decomposition method for modeling RDL traces on silicon interposer
Author
Biancun Xie ; Swaminathan, Madhavan ; Ki Jin Han ; Jianyong Xie
Author_Institution
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
fYear
2014
fDate
11-14 May 2014
Firstpage
1
Lastpage
4
Abstract
This paper proposes a 3-D finite-difference frequency-domain (FDFD) non-conformal domain decomposition method for solving three dimensional electromagnetic problems. The proposed method allows modeling individual domains independently using the FDFD method with non-matching meshing grids at interfaces. Field continuity at interfaces between domains are enforced by introducing Lagrange multiplier and vector basis functions at the interfaces. The accuracy and efficiency of the proposed approach are demonstrated by numerical results for simulation of redistribution layer transmission lines on lossy silicon interposer.
Keywords
computational electromagnetics; finite difference methods; frequency-domain analysis; 3D FDFD nonconformal domain decomposition method; 3D finite-difference frequency-domain nonconformal domain decomposition method; Lagrange multiplier; RDL traces; field continuity; lossy silicon interposer; nonmatching meshing grids; redistribution layer transmission lines; three dimensional electromagnetic problems; vector basis functions; Electromagnetics; Equations; Integrated circuit modeling; Mathematical model; Numerical models; Silicon; Vectors; 3-D finite-difference frequency-domain; Domain Decomposition; Lagrange multiplier; Non-conformal; vector basis functions;
fLanguage
English
Publisher
ieee
Conference_Titel
Signal and Power Integrity (SPI), 2014 IEEE 18th Workshop on
Conference_Location
Ghent
Type
conf
DOI
10.1109/SaPIW.2014.6844549
Filename
6844549
Link To Document