• DocumentCode
    166306
  • Title

    3-D FDFD non-conformal domain decomposition method for modeling RDL traces on silicon interposer

  • Author

    Biancun Xie ; Swaminathan, Madhavan ; Ki Jin Han ; Jianyong Xie

  • Author_Institution
    Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
  • fYear
    2014
  • fDate
    11-14 May 2014
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    This paper proposes a 3-D finite-difference frequency-domain (FDFD) non-conformal domain decomposition method for solving three dimensional electromagnetic problems. The proposed method allows modeling individual domains independently using the FDFD method with non-matching meshing grids at interfaces. Field continuity at interfaces between domains are enforced by introducing Lagrange multiplier and vector basis functions at the interfaces. The accuracy and efficiency of the proposed approach are demonstrated by numerical results for simulation of redistribution layer transmission lines on lossy silicon interposer.
  • Keywords
    computational electromagnetics; finite difference methods; frequency-domain analysis; 3D FDFD nonconformal domain decomposition method; 3D finite-difference frequency-domain nonconformal domain decomposition method; Lagrange multiplier; RDL traces; field continuity; lossy silicon interposer; nonmatching meshing grids; redistribution layer transmission lines; three dimensional electromagnetic problems; vector basis functions; Electromagnetics; Equations; Integrated circuit modeling; Mathematical model; Numerical models; Silicon; Vectors; 3-D finite-difference frequency-domain; Domain Decomposition; Lagrange multiplier; Non-conformal; vector basis functions;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Signal and Power Integrity (SPI), 2014 IEEE 18th Workshop on
  • Conference_Location
    Ghent
  • Type

    conf

  • DOI
    10.1109/SaPIW.2014.6844549
  • Filename
    6844549