DocumentCode
1663153
Title
To achieve a novel weak snapback characteristic in the high voltage nLDMOS
Author
Chen, Shen-Li ; Wu, Tzung-Shian ; Hung-Wei Chen ; Chun-Hsing Shih ; Chen, Po-Ying
Author_Institution
Dept. of Electron. Eng., Nat. United Univ., Miaoli, Taiwan
fYear
2010
Firstpage
182
Lastpage
185
Abstract
A drain-side engineering to LDMOS by doping concentration and length modulations of the N-type adaptive layer to obtain weak snapback characteristic nLDMOS are presented in this work. It´s a novel method to reduce trigger voltage(Vt1) and to increase holding voltage(Vh). These efforts will be very suitable for the HV power management IC applications. Meanwhile, in this work, we will discuss trigger voltage, holding voltage and Ron resistance distribution of these novel HV nLDMOS devices.
Keywords
MIS devices; doping profiles; power integrated circuits; power semiconductor devices; HV power management IC applications; N-type adaptive layer; R<;sub>on<;/sub> resistance distribution; doping concentration; high voltage nLDMOS; length modulations; novel weak snapback characteristic; Doping; Electrostatic discharge; Lead; ESD; RESURF; holding voltage; latch-up; nLDMOS; snapback; trigger voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Next-Generation Electronics (ISNE), 2010 International Symposium on
Conference_Location
Kaohsiung
Print_ISBN
978-1-4244-6693-1
Type
conf
DOI
10.1109/ISNE.2010.5669169
Filename
5669169
Link To Document