DocumentCode :
1663153
Title :
To achieve a novel weak snapback characteristic in the high voltage nLDMOS
Author :
Chen, Shen-Li ; Wu, Tzung-Shian ; Hung-Wei Chen ; Chun-Hsing Shih ; Chen, Po-Ying
Author_Institution :
Dept. of Electron. Eng., Nat. United Univ., Miaoli, Taiwan
fYear :
2010
Firstpage :
182
Lastpage :
185
Abstract :
A drain-side engineering to LDMOS by doping concentration and length modulations of the N-type adaptive layer to obtain weak snapback characteristic nLDMOS are presented in this work. It´s a novel method to reduce trigger voltage(Vt1) and to increase holding voltage(Vh). These efforts will be very suitable for the HV power management IC applications. Meanwhile, in this work, we will discuss trigger voltage, holding voltage and Ron resistance distribution of these novel HV nLDMOS devices.
Keywords :
MIS devices; doping profiles; power integrated circuits; power semiconductor devices; HV power management IC applications; N-type adaptive layer; R<;sub>on<;/sub> resistance distribution; doping concentration; high voltage nLDMOS; length modulations; novel weak snapback characteristic; Doping; Electrostatic discharge; Lead; ESD; RESURF; holding voltage; latch-up; nLDMOS; snapback; trigger voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Next-Generation Electronics (ISNE), 2010 International Symposium on
Conference_Location :
Kaohsiung
Print_ISBN :
978-1-4244-6693-1
Type :
conf
DOI :
10.1109/ISNE.2010.5669169
Filename :
5669169
Link To Document :
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