DocumentCode
1663421
Title
A method of feature extraction from an image for quality analysis
Author
Fukushima, Takashi ; Narazaki, Hiroshi ; Konishi, Masami
Author_Institution
Kobe Steel Ltd., Hyogo, Japan
Volume
2
fYear
1999
fDate
6/21/1905 12:00:00 AM
Firstpage
952
Abstract
We propose a method for feature extraction from a two-dimensional pattern with an application to a semiconductor´s quality management problem. Given a distribution pattern of defected chips on a wafer, our method generates a linguistic description such as “There is a medium-size dense lump of defected chips at the upper right corner of the wafer.” In addition to the use as a report for a quality manager, this description is used as an index to retrieve wafer data having similar patterns because similar patterns tend to suggest that the failures are caused by similar causes. Our method generates a linguistic description by the following two steps; First, we generate a dendrogram of defected chips using a hierarchical clustering method. Then, using the dendrogram, we identify an optimum granularity of cluster distribution, and each cluster is associated with a linguistic description. Through experiments, the description generated by our method is found to agree well with expert engineers judgement
Keywords
feature extraction; quality management; defected chips; dendrogram; feature extraction; hierarchical clustering method; optimum granularity; quality analysis; two-dimensional pattern; Bismuth; Clustering methods; Feature extraction; Frequency; Image analysis; Information retrieval; Manufacturing processes; Quality management; Semiconductor device manufacture; Steel;
fLanguage
English
Publisher
ieee
Conference_Titel
Systems, Man, and Cybernetics, 1999. IEEE SMC '99 Conference Proceedings. 1999 IEEE International Conference on
Conference_Location
Tokyo
ISSN
1062-922X
Print_ISBN
0-7803-5731-0
Type
conf
DOI
10.1109/ICSMC.1999.825391
Filename
825391
Link To Document