DocumentCode
1663637
Title
An 18.6Gb/s double-sampling receiver in 65nm CMOS for ultra-low-power optical communication
Author
Nazari, Meisam Honarvar ; Emami-Neyestanak, Azita
Author_Institution
California Inst. of Technol., Pasadena, CA, USA
fYear
2012
Firstpage
130
Lastpage
131
Abstract
Using optics for chip-to-chip interconnects has recently gained a lot of interest. As data rates scale to meet increasing bandwidth requirements, the shortcomings of copper channels are becoming more severe. Hybrid integration of optical devices with electronics has been demonstrated to achieve high performance, and recent advances in silicon photonics have led to fully integrated optical signaling. These approaches pave the way to massively parallel optical communications. Dense arrays of optical detectors require very low-power, sensitive, and compact optical receiver circuits. Existing designs for the input receiver, such as TIA, require large power consumption to achieve high band width and low noise, and can occupy large area due to bandwidth-enhancement inductors. In this work, a compact low-power optical receiver that scales well with technology is designed to explore the potential of optical signaling for future chip-to-chip and on-chip communication.
Keywords
CMOS integrated circuits; inductors; integrated optics; integrated optoelectronics; low-power electronics; optical communication; optical interconnections; optical receivers; optical sensors; sensor arrays; CMOS technology; TIA; bandwidth-enhancement inductor; bit rate 18.6 Gbit/s; chip-to-chip optic interconnection; compact low-power optical receiver circuit; copper channel; double-sampling receiver; integrated optical signaling; massively parallel optical communication; optical detector dense array; optical device integration; photonic; power consumption; size 65 nm; ultralow-power optical communication; Fiber optics; Optical buffering; Optical receivers; Optical saturation; Optical sensors; Photodiodes;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Circuits Conference Digest of Technical Papers (ISSCC), 2012 IEEE International
Conference_Location
San Francisco, CA
ISSN
0193-6530
Print_ISBN
978-1-4673-0376-7
Type
conf
DOI
10.1109/ISSCC.2012.6176949
Filename
6176949
Link To Document