DocumentCode
1663874
Title
Conformal photoresist coating for critical dimension improvement
Author
Supadee, Laddawan ; Titiroongruang, Wisut
Author_Institution
Electr. Eng. Fac., King Mongkut´´s Inst. of Technol., Bangkok, Thailand
fYear
2010
Firstpage
454
Lastpage
455
Abstract
3D surface topography of read / write head fabrication is difficult for lithography process. Photoresist deposition by using the conventional spin coating method is troubled. Spray coating is a replacement technique that eliminates the problem by producing micro-resist droplets that adhere firmly to the deposition location; thus, spray coating with optimal parameters from designed experiment is a suitable method for photoresist deposition on structures with high aspect ratio. By using proper nitrogen flow rate to spread out AZ4999 resist to be micro-droplet in the same time with proper traveling nozzle speed, the photoresist turbulence will perform good resist coverage over all surfaces. From design of experiment show the optimum condition for conformal deposition is 0.8 Bar at 117 mm/s for nitrogen pressure and nozzle speed, respectively. Photoresist thickness was dropped at 30um far away from groove or edge of the head.
Keywords
magnetic heads; photoresists; spray coating techniques; surface topography; 3D surface topography; conformal photoresist coating; critical dimension improvement; microresist droplets; nozzle speed; photoresist turbulence; read/write head; spin coating method; spray coating; Coatings; Lithography; Magnetic heads; Memory; Nitrogen; Resists; Scanning electron microscopy; Spraying; Surface topography; US Department of Energy;
fLanguage
English
Publisher
ieee
Conference_Titel
Nanoelectronics Conference (INEC), 2010 3rd International
Conference_Location
Hong Kong
Print_ISBN
978-1-4244-3543-2
Electronic_ISBN
978-1-4244-3544-9
Type
conf
DOI
10.1109/INEC.2010.5424787
Filename
5424787
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