Title :
Application of multi-wall carbon nanotube/SiC composite to thermal dissipation of high-bright light emitting diode
Author :
Li, Bing-Jing ; Chang, Chih-Hsiang ; Su, Yan-Kuin ; Gan, Kwang-Jow ; Hong, Jia-Wei
Author_Institution :
Dept. of Electr. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
Abstract :
A novel CNT/SiC/epoxy composite was proposed and demonstrated as adhesive joining element and heat dissipation media for HB-LEDs. Junction temperature, luminous intensity and forward voltage were measured for varied combinations in the composites. The experimental results showed that the epoxy with 30 wt% of SiC and 5 wt% of MWCNTs had the best thermal properties. Comparing to commercial epoxy, the CNT/SiC/ epoxy could decrease junction temperature from 123°C to 93°C and thermal resistance from 81°C /W to 65°C/W.
Keywords :
adhesive bonding; adhesives; carbon nanotubes; cooling; intensity measurement; light emitting diodes; nanocomposites; silicon compounds; temperature measurement; thermal resistance; voltage measurement; C-SiC; CNT-SiC-epoxy composite; HB-LED; MWCNT; adhesive joining element; forward voltage measurement; heat dissipation media; high-bright light emitting diode; junction temperature; luminous intensity; multiwall carbon nanotube-SiC composite; thermal dissipation; thermal resistance; Doping; Light emitting diodes; Silicon carbide; carbon nanotube; high-power light emitting diode; junction temperature; thermal resistance;
Conference_Titel :
Next-Generation Electronics (ISNE), 2010 International Symposium on
Conference_Location :
Kaohsiung
Print_ISBN :
978-1-4244-6693-1
DOI :
10.1109/ISNE.2010.5669200
