Title :
A new circuit model of multi-quantum well Vertical-Cavity Surface-Emitting Lasers
Author :
Qi, Chang ; Shi, Xinzhi ; Wang, Gaofeng ; Hu, Jicheng
Author_Institution :
Inst. of Microelectron. & Inf. Technol., Wuhan Univ., Wuhan, China
Abstract :
In this paper, a new high order circuit model of multi-quantum well vertical-cavity surface-emitting Lasers (VCSEL) based on a modified rate-equation is presented. This model is accounts for both thermal and spatial dependences of VCSEL characteristics. A new logarithmic relation of optical gain on carrier density substitutes for the linear relation in the conventional rate equation for quantum well lasers. A four-term Bessel-series expansion for the VCSEL carrier number is utilized to achieve good accuracy. A zero-order Laguerre-Guassian beam is utilized for describing the photo distribution to simplify the computation. This model can be readily used in SPICE-like circuit simulators. Numerical examples are introduced to replicate the multi-quantum well VCSEL´s typical dc, Small-signal and transient operation, including temperature-dependent light-current (LI) curves, modulation responses, and diffusive turn-off transients. Furthermore, we verify our model against other lower order model from reported in the literature.
Keywords :
Bessel functions; carrier density; laser beams; quantum well lasers; surface emitting lasers; Bessel-series expansion; carrier density substitutes; high order circuit model; modified rate-equation; multi-quantum well vertical-cavity surface-emitting lasers; optical gain; thermal model; zero-order Laguerre-Guassian beam; Charge carrier density; Circuits; Computational modeling; Distributed computing; Equations; Laser beams; Laser modes; Quantum well lasers; Surface emitting lasers; Vertical cavity surface emitting lasers; Thermal Model; Vertical-Cavity Surface-Emitting Lasers (VCSEL); high order equivalent circuit model; modified rate-equation; multi-quantum well; spatial dependence;
Conference_Titel :
Nanoelectronics Conference (INEC), 2010 3rd International
Conference_Location :
Hong Kong
Print_ISBN :
978-1-4244-3543-2
Electronic_ISBN :
978-1-4244-3544-9
DOI :
10.1109/INEC.2010.5424794