Title :
A ΔΣ interface for MEMS accelerometers using electrostatic spring-constant modulation for cancellation of bondwire capacitance drift
Author :
Lajevardi, Pedram ; Petkov, Vladimir ; Murmann, Boris
Author_Institution :
Stanford Univ., Stanford, CA, USA
Abstract :
Precision accelerometers are used in a variety of automotive applications, navigation systems, and low-level vibration-monitoring systems. Currently, these sensors are factory-calibrated to null their input offset. However, the residual offset drifts mainly due to thermal and mechanical stress and humidity. As a result, the offset accuracy of high-end MEMS accelerometers is specified on the order of ±100mg. With continuously increasing precision requirements, it is desirable to develop new techniques that address post-calibration drift. In this paper, we describe an accelerometer interface that continuously measures and cancels offset drift due to change in parasitic capacitance of the bondwires in a system-in-package-type MEMS accelerometer. The proposed technique reduces the bondwire offset of the measured prototypes by 41dB down to 6.24mg.
Keywords :
accelerometers; electrostatic devices; micromechanical devices; system-in-package; ΔΣ interface; MEMS accelerometer; accelerometer interface; bondwire capacitance drift; bondwire offset; electrostatic spring-constant modulation; humidity; mechanical stress; parasitic capacitance; precision accelerometer; system-in-package; thermal stress; Accelerometers; Bandwidth; CMOS integrated circuits; Micromechanical devices; Modulation; Noise; Sensors;
Conference_Titel :
Solid-State Circuits Conference Digest of Technical Papers (ISSCC), 2012 IEEE International
Conference_Location :
San Francisco, CA
Print_ISBN :
978-1-4673-0376-7
DOI :
10.1109/ISSCC.2012.6176972