• DocumentCode
    1664549
  • Title

    Effect of collagen treatment on the biocompatibility of β-Ti-14Mo-3Nb-3Al-0.2Si alloy

  • Author

    Song, Jun-Young ; Kim, Tae-Ho ; Hong, Sun Ig

  • Author_Institution
    Dept. of Adv. Mater. Eng., Chungnam Nat. Univ., Daejeon, South Korea
  • fYear
    2010
  • Firstpage
    1421
  • Lastpage
    1422
  • Abstract
    Titanium and Titanium alloys have been widely used in aerospace and automotive industries and medical applications due to their high strength-to-density ratio, excellent fatigue and corrosion resistances. Especially metastable ß titanium alloys are increasingly attractive for commercial use in high strength structural components because of their excellent cold formability. Some ß titanium alloys are being used as bone implants under biomechanical loading condition because of its excellent biocompatibility and mechanical properties. An essential requirement for an artificial material to bond to living bone is the formation of a bonelike apatite layer on its surface in body environment. The formation of a bone-like apatite surface layer can be reproduced in an acellular simulated body fluid (SBF) with ion concentration nearly equal to those of inorganic part of human blood plasma. In this study, biomimetic apatite deposition behaviors in various SBF conditions and stress-strain responses of Ti-15Mo-3Nb-3Al-0.2Si alloy were examined.
  • Keywords
    aluminium alloys; biomechanics; biomedical materials; biomimetics; bone; molybdenum alloys; niobium alloys; prosthetics; silicon alloys; stress-strain relations; titanium alloys; TiMoNbAlSi; biocompatibility; biomechanical loading; biomimetic apatite deposition; bone implants; collagen treatment effect; living bone; simulated body fluid conditions; stress-strain responses; Ã\x9f titanium alloys; Aerospace industry; Automotive engineering; Biomedical equipment; Bones; Corrosion; Fatigue; Medical services; Metastasis; Plasma simulation; Titanium alloys;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nanoelectronics Conference (INEC), 2010 3rd International
  • Conference_Location
    Hong Kong
  • Print_ISBN
    978-1-4244-3543-2
  • Electronic_ISBN
    978-1-4244-3544-9
  • Type

    conf

  • DOI
    10.1109/INEC.2010.5424812
  • Filename
    5424812