Title :
A measurement system for the acquisition of degradation data in AlCu metallizations
Author :
Catelani, M. ; Nicoletti, R. ; Baggiani, M. ; Singuaroli, R.
Author_Institution :
Dept. of Electron. & Telecommun., Florence Univ., Italy
fDate :
6/24/1905 12:00:00 AM
Abstract :
A fully custom designed automatic measurement system has been realized in order to acquire degradation data on thin-film AlCu metal test patterns, performing 4-wire resistive measures. A thermal reliability test is performed and degradation data are presented.
Keywords :
aluminium alloys; automatic test equipment; copper alloys; data acquisition; electromigration; integrated circuit metallisation; integrated circuit reliability; integrated circuit testing; thermal stresses; voids (solid); ASDA board; AlCu; LabView software; PC serial port; RS-232 protocol; ULSI; VLSI; automatic measurement system; degradation data acquisition; digital multimeter; electromigration; four-wire resistive measures; fully custom designed system; stress voiding; thermal reliability test; thermal stress; thin-film metal test patterns; Automatic testing; Circuit testing; Decoding; Metallization; Performance evaluation; System testing; Thermal degradation; Thermal stresses; Transistors; Variable speed drives;
Conference_Titel :
Instrumentation and Measurement Technology Conference, 2002. IMTC/2002. Proceedings of the 19th IEEE
Print_ISBN :
0-7803-7218-2
DOI :
10.1109/IMTC.2002.1006895
